Raytheon Company

Paul A Danello

Thomas V Sikina

James E Benedict

Andrew R Southworth

Joseph R Ellsworth

Scott R Cheyne

Mikhail Pevzner

Richard A Stander

Thomas J Tellinghuisen

Michael D Goulet

Anthony Carrara

Joseph A Mirabile

A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.

Process for removing bond film from cavities in printed circuit boards

A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Conduction cooling of multi-channel flip chip based panel array circuits

In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Cooling active circuits

A symmetric wedgelock system includes a compression device having a longitudinal axis; a plurality of segments arranged along the compression device including at least one drive segment at each end and at least one working segment in between each working segment including at least two sections having diverging sides forming a concave wedge facing an associated drive segment; each drive segment having converging sides forming a convex wedge facing an associated working segment; the compression device includes an adjustment device for applying a compressive force along the longitudinal axis to drive the convex wedges of the drive segment into the concave wedges of the working segment to drive apart laterally the sections of the working segment.

Wedgelock system

Growing community of inventors

Franklin, MA, United States of America

Paul A Danello