Celestica International Inc.

Paul A Bussiere

Ralph I Larson

Amy Allen

John Bird

David D Williams

Kevin Alan Patin

Michael S Boudreaux

Lyne Doré-North

Lyne Doré North

Armando Rocha Lopez

Wesley B Morgan

Lyne Dor&eacute; North

Ralph Jensen

A flat panel display structure is disclosed that can support significant loads on the viewing surface without fracturing or permanently damaging the video display. A rigid body is fitted in a peripheral frame and situated behind the viewing surface. When a load is applied to the video display, the load is transferred to the rigid body, which absorbs and distributes the load to the peripheral frame.

Robust display device having particular rigid body

The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

System and method for mounting a heat sink

A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Electronics cooling subassembly

A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Heat removal system

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Twin Mountain, NH, United States of America

Paul A Bussiere