Koninklijke Philips Corporation N.v.

Signify Holding B.v.

Siemens Healthineers Nederland B.v.

Patrick Zuidema

Rifat Ata Mustafa Hikmet

Joris Jan Vrehen

Norbertus Antonius Maria Sweegers

Jeroen Hans Nieuwenhuis

Paulus Albertus Van Hal

Mark Johannes Antonius Verhoeven

Petrus Johannes Wilhelmus Van Lankvelt

Marc Andre De Samber

Louis Nicolas Atallah

Bernardus Jozef Maria Beerling

Wendela Meertens

Bert Wouters

Gwendolyn Anita Luiten

The invention describes a method of predicting a stabilization temperature (T) of a subject () with a heat-flow sensor () comprising a plurality of thermistors (S, S, SA, SA, SB, SB), which method comprises the steps of expressing the temperature development of the heat-flow sensor () as a stretched exponential equation characterized by a time constant (&#x3c4;) and a sensor characteristic scalar value (m); receiving temperature measurement values (T, T, T, T) collected by the thermistors (S, S, SA, SA, SB, SB); estimating the time constant (&#x3c4;) on the basis of the temperature measurement values (T, T, T, T); and deducing the future stabilization temperature (T) on the basis of the estimated time constant (&#x3c4;). The invention further describes heat-flow sensor () and a temperature sensing arrangement ().

Method of predicting a stabilization temperature of a heat-flow sensor

A finned heat sink, folded from a single piece of plate material, includes a base part and a plurality of fins. The base part includes a plurality of fin extensions and at least one support element. The support element includes bridging parts bridging the inter-fin distances, wherein the bridging parts comprise length reducing parts to thereby reduce those inter-fin distances.

Folded sheet metal heat sink

A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Light emitting device cooling

A sensor system () includes a reader () with a sensor unit () and an accommodation Space () for an exchangeable cartridge (). The cartridge () is held in the accommodation space () by at least one contact element () which has an increased thermal resistance and/or a contact area of reduced size. Thus a more homogenous temperature distribution can be achieved within the cartridge (), reducing distortions which might adversely affect optical measurements.

Sensor system with an exchangeable cartridge and a reader

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Mierlo, Netherlands

Patrick Zuidema