Robert Boschgmbh

Patrick Wellner

Johannes Classen

Axel Franke

Lars Tebje

Dietrich Schubert

Heribert Weber

Frank Fischer

Mirko Hattass

Jens Frey

Christoph Gauger

Burkhard Kuhlmann

Daniel Christoph Meisel

Helmut Grutzeck

Arnd Kaelberer

Ronny Ludwig

Rainer Straub

Florian Grabmaier

Harald Emmerich

Eric Ochs

Stephan Henzler

Markus Heitz

Christian Patak

Rolf Kaack

Sebastian Gracki

Christian Voehringer

A rotation rate sensor including a substrate having a principal plane of extension, and a structure movable with respect to the substrate; the structure being excitable from a neutral position into an oscillation having a movement component substantially parallel to a driving direction, which is substantially parallel to the principal plane of extension. To induce the oscillation, the rotation rate sensor includes a comb electrode moved along with the structure and a comb electrode fixed in position relative to the substrate. The excitation is produced by applying a voltage to the moving comb electrode and/or to the stationary comb electrode. Due to a rotation rate of the rotation rate sensor about an axis running substantially perpendicularly to the driving direction and substantially perpendicularly to the detection direction, a force applied to the structure with a force component along a detection direction substantially perpendicular to the driving direction is detectable.

MEMS rotation rate sensor including combined driving and detection

A sensor structure includes a substrate having a main extension plane, a first seismic mass and a second seismic mass, the first and the second seismic masses being deflectable relative to the substrate along a direction of deflection essentially perpendicular to the main extension plane. The first and second seismic masses are coupled together via a rigid coupling rocker pivotable around a rocker axis parallel to the main extension plane. The first seismic mass is suspended from the substrate with the aid of a first suspension spring, and an essentially rigid first coupling bar is situated between the first suspension spring and the first seismic mass.

Sensor structure and yaw rate sensor

A method for operating and/or measuring a micromechanical device. The device has a first and second seismic mass which are movable by oscillation relative to a substrate; a first drive device for deflecting the first seismic mass and a second drive device for deflecting the second seismic mass, parallel to a drive direction in a first orientation; a third drive device for deflecting the first seismic mass, and a fourth drive device for deflecting the second seismic mass in parallel to the drive direction and according to a second orientation opposite from the first orientation; a first detection device for detecting drive motion of the first seismic mass; and a second detection device for detecting drive motion of the second seismic mass. A first and a second detection signal are generated by the first and second detection devices, the first detection signal being evaluated separately from the second detection signal.

Method for operating and/or for measuring a micromechanical device, and micromechanical device

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

Hybrid integrated component

An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.

Acceleration sensor and method for operating an acceleration sensor

An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

Electrical device having a lubricated joint and a method for lubricating such a joint

A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap

Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Hybrid intergrated component and method for the manufacture thereof

An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

Acceleration sensor and method for its manufacture

A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.

Growing community of inventors

Walddorfhaeslach, Germany

Patrick Wellner