Microsoft Technology Licensing, LLC

Patrick Timothy Codd

Agustya Ruchir Mehta

Scott Fullam

Barry Thompson

Martin Francis Galinski, Iii

Brandon Baxter Harris

Chang Joon Park

Niranjan Achugundla Puttaswamy

David Simon Lukofsky

Hanfeng Wang

Joseph Christopher Bolling

Scott Francis Fullam

Agustya Ruchir Metha

A system is provided for maintaining a safe operating area while also providing a suitable forward bias voltage to drive a laser diode. The system can monitor a voltage that is applied to a laser diode driver using a threshold that is based on the fabrication process of the laser diode driver. For example, a system can utilize a first threshold for a laser diode driver that is fabricated utilizing a 10 nm process and utilize a second threshold for another laser diode driver that is fabricated utilizing a 20 nm process. The threshold can also be based on a color of the laser or a desired operation mode. The system can monitor a voltage applied to a laser diode using different thresholds while controlling a bleed current to ensure that the laser diode is forward biased while mitigating the risk of silicon breakdown of the laser diode driver.

Laser diode driver break-down protection scheme

In an electronic device having a compact form factor, a space-saving harness using bundled or ribbonized strands of micro-coaxial (micro-coax) cable may be utilized to provide signal and/or power interconnects between EMI-generating peripheral components and other components in the device such as those populated on circuit boards. Discrete wires are included in the harness to provide shielding to adjacent micro-coax conductors which may carry high speed signals such as MIPI (Mobile Industry Processor Interface) differential signal pairs and provide power and ground return paths. The discrete wires are subjected to fabrication processes during assembly of the micro-coax harness so that their outer diameters substantially match that of components in the micro-coax cable to thereby facilitate connectorization or termination to the circuit boards and/or other components in the device. The matching outer diameters can also provide a consistent pitch that may facilitate space-saving geometries for the harness, connector, and/or terminations.

Space-saving micro-coax cable harness

Embodiments are disclosed for a printed circuit board. An example printed circuit board includes a ground plane comprising a pattern of an electrically conductive material. The example printed circuit board further includes a circuit trace disposed adjacent to the ground plane, where one or more characteristics of one of more of the pattern of the electrically conductive material in the ground plane and the circuit trace vary based upon a directional change of the circuit trace.

Avoiding reflections in PCB signal trace

In an electronic device that employs high-speed differential signaling on one or more pairs of conductors in a flexible printed circuit, RF chokes are placed in the differential signal path and mounted directly on the flexible printed circuit which is used to interconnect a peripheral device, such as an image sensor, through a connector to another device component such as a main printed circuit board. The RF chokes are configured to suppress common-mode noise propagating in the differential pairs of conductors. In one illustrative embodiment, the RF chokes are located on the flexible printed circuit adjacent to the peripheral device to suppress common-mode noise near its source. In another illustrative embodiment, the RF chokes are mounted adjacent to the connector to suppress the common-mode noise before it has an opportunity to escape the flexible printed circuit at the major discontinuity presented by the connector.

Flexible printed circuit with radio frequency choke

In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.

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Belmont, CA, United States of America

Patrick Timothy Codd