International Business Machines Corporation

Patrick T Flynn

Thomas E Kindl

Christopher G Angulas

Joseph Funari

Randy L Orr

Orr Randy L

A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circuitized substrate being secured thereto.

Flexible circuit member

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, 'balls up' and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.

Method for bonding flexible circuit to circuitized substrate to provide

Method of bonding flexible circuit to cicuitized substrate to provide

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, forms a substantially spherical ball and connects to the flexible circuit's conductor, connecting the two. In an alternative embodiment, the solder ball is formed to its desired shape and cooled (to solidification), separate from the flexible circuitized substrate. The flexible substrate is then lowered until the conductor engages the solder ball's upper surface. Heat is then applied to bond solder and conductor.

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Owego, NY, United States of America

Patrick T Flynn