Hitachi Global Storage Technologies Netherlands B.v.

International Business Machines Corporation

Hitachi Global Storage Technologies

Patrick Rush Webb

Mustafa Pinarbasi

Richard Hsiao

Son Van Nguyen

Quang Le

Paul Phong Nguyen

Howard Gordon Zolla

James Mac Freitag

Denny Tang

James Bernard Kruger

Edward Hin Pong Lee

Sue Siyang Zhang

Prakash Kasiraj

Neil Leslie Robertson

Yi Zheng

Wipul Jayasekara

Daniel Wayne Bedell

Hieu Lam

James Devereaux Jarratt

Samuel Wei-san Yuan

Bradley Douglas Webb

Benjamin L Wang

Hardayal Singh Gill

Vladimir Nikitin

Kuok San Ho

Kim Yang Lee

Wen-Chien David Hsiao

Ching Hwa Tsang

Elizabeth Ann Dobisz

Frederick Hayes Dill

Tsung Yuan Chen

Hua Ai Zeng

Serhat Metin

Phong V Chau

Benjamin Lu Chen Wang

Clint D Snyder

Wipul Pemsiri Jayaekara

Raymond Bus-Kwofie

Lichiao Metin

Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Use of anti-reflective seed layers for the fabrication of perpendicular thin film heads

Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Use of metal capped seed layers for the fabrication of perpendicular thin film heads

An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.

Method of fabricating a thin film magnetic sensor on a wafer

A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF/CHF). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H/N/CHF/CHreducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure. Chemical-mechanical polishing may then be used to planarize the conductive material.

Magnetic head coil system and damascene/reactive ion etching method for manufacturing the same

A bi-layer anti-reflective coating for use in photolithographic applications, and specifically, for use in ultraviolet photolithographic processes. The bi-layered anti-reflective coating is used to minimize pattern distortion due to reflections from neighboring features in the construction of microcircuits. The bi-layer anti-reflection coating features a first layer, an absorption layer, disposed on a second layer, a dielectric layer, which is then disposed between a substrate and a photoresist layer. The dielectric/absorption layer comprises one combination selected from Ta/AlO, Ta/SiO, Ta/TiO, Ta/TaO, Ta/CrO, Ta/SiN, Ti/AlO, Ti/SiO, Ti/TiO, Ti/TaO, Ti/CrO, Ti/SiN, Cr/AlO, Cr/SiO, Cr/TiO, Cr/TaO, Cr/CrO, Cr/SiN, Al/AlO, Al/TiO, Al/TaO, Al/CrO, Al/SiN, Ni/AlO, Ni/SiO, Ni/TiO, Ni/TaO, Ni/CrO, Ni/SiN, Ir/AlO, Ir/SiO, Ir/TiO, Ir/TaO, Ir/CrO, and Ir/SiN. At least the absorption and dielectric layers can be formed using vacuum deposition. A unique character of the bi-layer anti-reflective coatings is that it allows a thinner anti-reflection layer that has a wider process latitude.

Structure for photolithographic applications using a multi-layer anti-reflection coating

The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.

Magnetoresistive/inductive write head assembly formed with seed layers having a uniform thickness

An article is formed as a substrate having a projection extending outwardly therefrom. The article may be a magnetic recording head and the projection a write pole. The projection has a width in a thinnest dimension measured parallel to a substrate surface of no more than about 0.3 micrometers and a height measured perpendicular to the substrate of not less than about 5 times the width. The article is fabricated by forming an overlying structure on the substrate with an edge thereon, depositing a replication layer lying on the edge, depositing a filler onto the edge and the substrate, so that the filler, the replication layer, and the overlying structure in combination comprise a continuous layer on the substrate, selectively removing at least a portion of the replication layer from a free surface of the continuous layer inwardly toward the substrate, to form a defined cavity, and depositing a projection material into the defined cavity to form the projection.

Method of fabricating a narrow projection such as a write pole extending from a substrate

A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.

Method for manufacturing a magnetic head coil structure and/or pole tip structure

Magnetic head coil structure and method for manufacturing the same

A magnetic head having a spin valve sensor that is fabricated utilizing an AlO, NiMn0, Si seed layer upon which a PtMn spin valve sensor layer structure is subsequently fabricated. In the preferred embodiment, the Si layer has a thickness of approximately 20 &#x212b; and the PtMn layer has a thickness of approximately 120 &#x212b;. An alternative fabrication process of the Si layer includes the overdeposition of the layer to a first thickness of from 15 &#x212b; to 45 &#x212b; followed by the etching back of the seed layer of approximately 5 &#x212b; to approximately 15 &#x212b; to its desired final thickness of approximately 20 &#x212b;. The Si layer results in an improved crystal structure to the subsequently fabricated PtMn and other spin valve sensor layers, such that the fabricated spin valve is thinner and exhibits increased &#x394;R/R and reduced coercivity.

Method for fabricating a magnetic head

A magnetoresistive read/write head having a first layer of alumina and a second layer of silicon dioxide overlaying a P3 layer of the head. In a preferred embodiment, the silicon dioxide layer is recessed away from an Air Bearing Surface (ABS) to reduce protrusion of a P2 layer and the P3 layer in the head, and to reduce degradation in the magnetic properties of the pole tips of the P2 and P3 layer ends.

Magnetic write head with recessed overcoat

Spin valve structure with Si seed layer and reduced PtMn antiferromagnetic layer thickness

A tri-layer anti-reflective coating for use in photolithographic applications, and specifically, for use in ultraviolet photolithographic processes. The tri-layered anti-reflective coating is used to minimize pattern distortion due to reflections from neighboring features in the construction of microcircuits. The tri-layer anti-reflection coating features a first layer, a first dielectric layer, an absorption layer disposed on the first dielectric layer, and a second dielectric layer, which is then disposed between the absorption layer and a photoresist layer. At least the absorption layer and dielectric layers can be formed using vacuum deposition. A unique character of the tri-layer anti-reflective coatings is that it dampens reflections structures having severe topologies and also allows a thinner anti-reflection layer that has a wider process latitude.

Method for forming thin film heads using a tri-layer anti-reflection coating for photolithographic applications and a structure thereof

A magnetoresistive sensor having bias stabilization tabs includes a protective cap layer. The protective cap layer prevents oxidation, avoids potential damage from using ion milling for oxidation removal, and lowers parasitic resistance. In one embodiment, a bias layer, having a central portion with quenched magnetic moment, is formed over the free layer with an intervening coupling layer. A disk drive is provided with the magnetoresistive sensor including a protective cap layer.

Low resistance antiparallel tab magnetoresistive sensor

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San Jose, CA, United States of America

Patrick Rush Webb