Northrop Grumman Systems Corporation

Patrick Loney

Robert Miles Young

Aaron Ashley Hathaway

John Xavier Przybysz

Daniel Robert Queen

Aaron A Pesetski

Justin C Hackley

Keith J Johanns

Nicolas P Bons

Patrick A Green

John K Przybysz

David Robert Queen

A threat analyzer receives threat data measured by detectors. The threat data characterizes a status of detected emissions for a corresponding detector. The threat analyzer analyzes the threat data to identify a geographic region that contains a threat to humans and stores the threat data and analyzed data in a database. The machine readable instructions also include a graphical user interface (GUI) generator that provides an interactive map with indicia that characterizes the analyzed threat data.

Threat data analyzer

An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.

Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics

A superconducting structure is provided that comprises a first superconducting device coupled to a second superconducting device employing a plurality of superconducting bump bond structures. Each of the plurality of superconducting bump bond structures comprise a first normal metal layer disposed on the top surface of a given one of a plurality of first contact pads, a second normal metal layer disposed on the top surface of a given one of a plurality of second contact pads, and a superconducting metal layer disposed between the first normal metal layer and the second normal metal layer. The metal thicknesses of each of the first normal metal layer, the second normal metal layer, and the specific material of the superconducting metal and normal metal are selected to inhibit the transfer of heat between the first superconducting device and the second superconducting device.

Multichip device with temperature isolating bump bonds

An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.

Thermally isolated ground planes with a superconducting electrical coupler

An integrated circuit is provided that comprises a resistor, a first superconducting structure coupled to a first end of the resistor, and a second superconducting structure coupled to a second end of the resistor. A thermally conductive heat sink structure is coupled to the second end of the resistor for moving hot electrons from the resistor prior to the electrons generating phonons.

Growing community of inventors

Fairview Park, OH, United States of America

Patrick Loney