At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Patrick Lenhardt

Wolfgang Schrittwieser

Sebastian Sattler

Klaus Merl

A component carrier including: i) a layer stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure, ii) a cavity formed in the layer stack, iii) a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able, and iv) an electrically insulating connection material between the dielectric element and the layer stack.

Component carrier with a dielectric element placed in a cavity and a manufacturing method

The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component () comprising contacts () oriented towards an insulating layer () which is fixed to a laminate consisting of a conductive layer () and a insulating layer (). Once the component () has been fixed to the insulating layer (), at least one hole or perforation () corresponding to the contacts () of the component () are formed in the conducting layer () and in the insulating layer (), the contacts come into contact with the conducting layer (), enabling a reliable integration or embedding of an electronic component () into a printed circuit board.

Growing community of inventors

Spielberg bei Knittelfeld, Austria

Patrick Lenhardt