Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Siemens Aktiengesellschaft

Patrick Kromotis

Georg Bogner

Bert Braune

Marcus Ruhnau

Stefan Grötsch

Günter Waitl

Jörg Erich Sorg

Moritz Engl

Heinrich Noll

Ralf Mayer

Mario Wanninger

Gerhard Kuhn

Wolfgang Gramann

Werner Späth

Torsten Baade

Matthias Winter

Werner Marchl

Ludwig Peyker

Josef Hüttner

Simone Kiener

Kristin Grosse

Emanuel Hofmann

Stefan GRÖTSCH

An optoelectronic component includes a housing having an electrically conductive first contact section, and an optoelectronic semiconductor chip arranged on the first contact section, wherein the optoelectronic semiconductor chip and the first contact section are at least partly covered by a first layer including a silicone, a second layer including SiOis arranged at a surface of the first layer, the second layer has a thickness of 10 nm to 1 &#x3bc;m, and a third layer is arranged above the second layer.

Optoelectronic component and method for the production thereof

An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

Optoelectronic component

A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size Aand a maximum acceptance angle &#x3b1; for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle &#x3b2;. At least one of the LED chips has a radiation decoupling area of the size A. The relation 0.7&#xb7;(A&#xb7;sin(&#x3b1;))/(A&#xb7;sin(&#x3b2;)&#xb7;n)&#x2266;N&#x2266;1.3&#xb7;(A&#xb7;sin(&#x3b1;))/(A&#xb7;sin(&#x3b2;)&#xb7;n) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

Projection apparatus

An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 &#x3bc;m. In addition, an illumination module comprising such a component is disclosed.

Optoelectronic component that emits electromagnetic radiation and illumination module

An illumination device for backlighting an image reproduction device containing light valves, the illumination device including a plurality of luminous spots arranged in grid format on a flat thermally conductive carrier. Each luminous spot having a plurality of light emitting diodes electrically insulated from one another, and a submount exhibiting good thermal conductivity and being connected to the carrier.

Illumination device having luminous spots formed by light emitting diodes

An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

LED array

An optoelectronic component () having a semiconductor arrangement () which emits and/or receives electromagnetic radiation and which is arranged on a carrier () which is thermally conductively connected to a heat sink (). External electrical connections () are connected to the semiconductor arrangement (), where the external electrical connections () are arranged in electrically insulated fashion on the heat sink () at a distance from the carrier (). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

Optoelectronic component and a module based thereon

An optoelectronic component having a basic housing or frame () and at least one semiconductor chip (), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity () of the basic housing. In order to increase the efficiency of the optoelectronic component (), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound () filled at least partly into the cavity () is provided, the material and the quantity of the filling compound () being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas () of the filling compound serve as reflector.

Optoelectronic component and method for producing it

A light source module having a plurality of LEDs connected to a metal carrier () by means of an insulating layer (). In order to afford protection against mechanical effects and in order to form a reflector, the LEDs are surrounded by a frame (), which is segmented into a plurality of parts by expansion joints (), in order that stresses occurring as a result of temperature fluctuations are absorbed.

Light source module and method for production thereof

The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier () and a reflector arrangement () disposed on said system carrier (), the reflector arrangement comprising a number of reflectors each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device ().

Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component

A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses () disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.

Radiation source and method for producing a lens mould

In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (B), averted from the transmitter or receiver (), of the filling material () is designed directly with a lens profile (). This is done by filling a defined quantity of the transparent filling material () into the recess (A) of the carrier body () for the purpose of embedding the transmitter or receiver (), and by subsequently impressing a lens profile () onto the surface (B), averted from the transmitter or receiver, of the transparent filling material () by means of a punch (), before the transparent filling material with the lens profile () thus impressed is completely cured.

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Wuppertal, Germany

Patrick Kromotis