Honeywell International Inc.

Patrick K Underwood

Susan D Strothers

Stephane Ferrasse

Frank C Alford

Jaeyeon Kim

Michael D Payton

Scott R Sayles

Marc D Ruggiero

Wayne D Meyer

Shih-Yao Lin

Ira G Nolander

Michael R Pinter

Erik L Turner

Lucia M Feng

A high strength aluminum alloy material comprises aluminum as a primary component and at least one of magnesium and silicon as a secondary component at a concentration of at least 0.2% by weight. The material has a Brinell hardness of at least 90 BHN, a yield strength of at least 250 MPa, an ultimate tensile strength of at least 275 MPa, and a percent elongation of at least 11.5%.

ECAE processing for high strength and high hardness aluminum alloys

An aluminum or copper alloy sputtering chamber includes a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the front surface A coating of titanium particles is formed on the sputter trap.

Sputter trap having a thin high purity coating layer and method of making the same

A method of forming a high strength aluminum alloy is disclosed. The method includes solutionizing to a temperature ranging from about 5&#xb0; C. above a standard solutionizing temperature to about 5&#xb0; C. below an incipient melting temperature for the aluminum material to form a heated aluminum material, which is then quenched. The aluminum material includes at least one of magnesium and silicon as a secondary component at a concentration of at least 0.2% by weight. The cooled aluminum material is subjected to ECAE processing using one of isothermal conditions and non-isothermal conditions. Isothermal conditions include having a billet and a die at the same temperature from about 80&#xb0; C. to about 200&#xb0; C. Non-isothermal conditions include having a billet at a temperature from about 80&#xb0; C. to about 200&#xb0; C. and a die at a temperature of at most 100&#xb0; C. The aluminum material is than aged at a temperature from about 100&#xb0; C. to about 175&#xb0; C.

A sputtering chamber component including a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the back surface, and a coating of metallic particles formed on the sputter trap. The coating has a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is substantially free of impurities, and the particles of the coating are substantially diffused.

The present disclosure relates generally to a planar sputtering target. In particular, the present disclosure provides a planar sputtering target comprising a planar sputtering surface and a back surface opposite the planar sputtering surface. The planar sputtering target is formed from a 2N purity tin having an average grain size from at least 10 mm to at most 100 mm. The present disclosure provides a method of manufacturing the tin planar sputtering target having an average grain size from at least 10 mm to at most 100 mm.

Large-grain tin sputtering target

Disclosed herein is a method of forming a high strength aluminum alloy. The method comprises heating an aluminum material to a solutionizing temperature for a solutionizing time such that the magnesium and zinc are dispersed throughout the extruded aluminum material to form a solutionized aluminum material. The method includes quenching the solutionized aluminum material to form a quenched aluminum material. The method also includes aging the quenched aluminum material to form an aluminum alloy, then subjecting the aluminum alloy to an ECAE process to form a high strength aluminum alloy.

ECAE materials for high strength aluminum alloys

A method of forming a high strength aluminum alloy. The method comprises subjecting an aluminum material containing at least one of magnesium, manganese, silicon, copper, and zinc at a concentration of at least 0.1% by weight to an equal channel angular extrusion (ECAE) process. The method produces a high strength aluminum alloy having an average grain size from about 0.2 &#x3bc;m to about 0.8 &#x3bc;m and a yield strength from about 300 MPa to about 650 MPa.

A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650&#xb0; C. to about 750&#xb0; C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500&#xb0; C. to about 650&#xb0; C. to form a copper alloy.

Method of forming copper alloy sputtering targets with refined shape and microstructure

A sputter trap formed on at least a portion of a sputtering chamber component has a plurality of particles and a particle size distribution plot with at least two different distributions. A method of forming a sputter trap having a particle size distribution plot with at least two different distributions is also provided.

Sputter trap having multimodal particle size distribution

A method of forming a high strength copper alloy. The method comprises heating a copper material including from about 2 wt. % to about 20 wt. % manganese by weight of the copper material to a temperature above 400&#xb0; C., allowing the copper material to cool to a temperature from about 325&#xb0; C. to about 350&#xb0; C. to form a cooled copper material, and extruding the cooled copper material with equal channel angular extrusion to form a cooled copper manganese alloy.

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Spokane Valley, WA, United States of America

Patrick K Underwood