Facebook Technologies, LLC

Oculus, Vr, LLC

Sensl Technologies Limited

Patrick Joseph Hughes

Pooya Saketi

William Padraic Henry

Joseph O'Keeffe

Daniel Brodoceanu

Oscar Torrents Abad

Vincent Brennan

Allan Pourchet

Karsten Moh

Andrew John Ouderkirk

Christopher Percival

David Massoubre

Tilman Zehender

Robin Sharma

Wanli Chi

James Ronald Bonar

Yijing Fu

John Carlton Jackson

James Small

Celine Claire Oyer

Alexander Udo May

William Anthony Wall

Thiago Martins Amaral

Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.

Optics formation using pick-up tools

Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

Techniques related to eye tracking using reverse-biased light-emitting diode (LED) devices are disclosed. In some embodiments, a viewing apparatus comprises a reverse-biased LED device that is positioned within a field-of-view of an eye. The reverse-biased LED device receives light reflected from the eye and generates signal based on the received light. The generated signal is used to determine a position of the eye.

Eye tracking using reverse-biased light-emitting diode devices

A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.

Formation of elastomeric layer on selective regions of light emitting device

Embodiments relate to transferring dies or other electronic components from a carrier substrate to a target substrate of a device as part of chip assembly for the device. Bonding material is applied to selected dies on a carrier substrate by direct boning, or to corresponding die transfer locations on a target substrate. The carrier substrate is then brought into contact with the target substrate to transfer each of the selected dies to the carrier substrate. Dies can also be directly bonded to the target substrate even in the presence of other die in situ (e.g., from a previous bonding cycle), hence, enables more than one direct bond cycle to be carried out for a target substrate. As such, multi-color (RGB) display elements can be assembled in stages (e.g., separate bonding cycles) in a flexible manner to provide redundancy or to replace inoperative LED dies.

Inorganic light emitting diode (ILED) assembly via direct bonding

Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Method and apparatus for use in the manufacture of a display element

Techniques related to laser lift-off masks are disclosed. In some embodiments, masking material is applied to a substrate that is attached to a plurality of semiconductor device sets. More specifically, the masking material is applied to one or more regions of the substrate between the semiconductor device sets. When the semiconductor device sets are embedded in a filling material, the masking material may be situated between the substrate and the filling material. Thus, transmitting light through the substrate toward the semiconductor device sets causes the substrate to become detached from the semiconductor device sets. However, the light is at least partially occluded by the masking material.

Laser lift-off masks

A lens assembly includes a plurality of micro-LEDs coupled to one or more circuitries affixed to a surface of a lens substrate. At least one micro-LED is positioned within a viewing region of the lens substrate. The viewing region is a region through which light emitted by an electronic display passes prior to reaching an eyebox. The lens assembly may be part of a head-mounted display (HMD). An eye tracking unit of the HMD includes the one or more micro-LEDs to project light onto a portion of a user's eye and a detector to collect reflected and/or scattered light from the illuminated portion of the eye. The eye tracking unit tracks the movement of the user's eye. Based on the tracked movement, the HMD adjusts presentation of displayed content such as focus and/or resolutions of the displayed content.

Lenses integrated with micro-light emitting diodes

Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.

Redundancy in inorganic light emitting diode displays

Embodiments relate to placing of semiconductor devices on a target substrate using a pick and place head (PPH) having a cross-section of a polygon shape and pick-up surfaces. The pick-up surfaces of the PPH are aligned with a carrier substrate mounted with the semiconductor devices, which may be light emitting diodes (LEDs). The PPH is moved toward one or more first semiconductor devices on the carrier substrate to pick up the one or more first semiconductor devices with a first pick-up surface of the PPH. The PPH is rotated to pick up one or more semiconductor devices dies with a second pick-up surface of the PPH. The one or more first semiconductor devices attached to the first pick-up surface and the one or more second semiconductor devices attached to the second pick-up surface are placed on a target substrate.

Picking up and placing of micro light emitting diodes using polygon tool

One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Method for polymer-assisted chip transfer

A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.

LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A voltage difference applied across the electrodes of each LED via the unidirectional conductive film powers the LEDs and causes the operational LEDs to emit light. An electrical parameter of each LED is measured and used to determine whether each LED is operational or non-operational. An elastomer deposition apparatus selectively deposits elastomer material on the operational LEDs, allowing for the operational LEDs to be picked up using the PUT, while not depositing elastomer material on the non-operational LEDs.

Direct wafer mapping and selective elastomer deposition

LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A photo-curable polymer is deposited on a surface of each LED. A voltage difference is applied across the electrodes of each LED via the unidirectional conductive film, causing the operational LEDs to emit light and cure the photo-curable polymer to form an elastomer layer, while the polymer deposited on the non-operational LEDs will not cure. As such, the PUT will be able to pick up the operational LEDs, while being unable to pick up the non-operational LEDs.

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Cork, Ireland

Patrick Joseph Hughes