General Electric Company

Patrick Jose Lazatin

Adam Gregory Pautsch

Satish Sivarama Gunturi

Daniel Jason Erno

Ruijie Shi

Jeffrey David Erno

A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber. Millichannels are formed in the body or are formed in at least one of the lids and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels are disposed in a radial arrangement, and the millichannels and the inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. A lidless heat sink is also provided.

Heat sinks with C-shaped manifolds and millichannel cooling

Methods and systems for energy recovery in desalination or other systems are provided to transfer the pressure energy from one fluid to anther fluid. A system for energy recovery with a container comprises two sections separated by one or plurality of flexible impermeable diaphragms and pressures of the two fluids in the two sections are transmitted during the cyclical filling and pumping operations, as well as flow control valves. As one embodiment, two flexible impermeable tubes operable to receive two fluids of different pressures respectively connect to flow control valves. The first fluid and the second fluid are separated by the flexible impermeable diaphragm formed by the flexible tubes. Cyclical inflows of the two fluids transmit the higher pressure of one fluid to the other through the diaphragm and transfer the energy from one fluid to the other.

Methods and systems for energy exchange

A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Growing community of inventors

Glenville, NY, United States of America

Patrick Jose Lazatin