General Electric Company

Tokyo Electron Limited

Patrick Jay Biel

Steven William Wik

Yakov Polishchuk

John Brandon Laflen

Glen William Brooksby

Jacques Faguet

Ronald W Nasman

S M Shajedul Hasan

Yang Zhao

System architecture that provides computer-based methods of wireless communication between a wireless metrological device and a mobile computing device that includes the sending/receiving of data (e.g., measurements) along with a universal generic data service that includes data descriptor(s) affiliated with the measurements. The architecture and methods, which may be communicated via BLE, allow for uniform communication between tools and mobile computing devices regardless of tool type, manufacturer, and measurement information.

System architecture for wireless metrological devices

A metrological interface device includes a printed circuit board ('PCB') including at least one metrological sensor communication interface and at least one first wireless communication interface. The metrological interface device is in communication with a metrological sensing device via the metrological sensor communication interface. Each metrological sensing device is coupled to a physical asset. Each metrological interface device is configured to receive the metrological data from the metrological sensing device. The metrological interface device is configured to receive metrological data from the metrological sensing device via the metrological sensor communication interface. Metrological data represents physical measurement data associated with the physical asset. Each metrological interface device is configured to advertise connection availability to a plurality of mobile computing devices, and also configured to receive a connection request from a connecting mobile computing device, and is additionally configured to create an active connection with the connecting mobile computing device.

Methods and systems for a universal wireless platform for asset monitoring

A method and system for depositing a thin film on a substrate using a vapor deposition process is described. The processing system comprises a gas heating device for heating one or more constituents of a film forming composition. The gas heating device comprises one or more resistive heating elements configured to receive an electrical current from one or more power sources. Additionally, the gas heating device comprises a mounting structure configured to support the one or more resistive heating elements. Furthermore, the gas heating device comprises one or more static mounting devices coupled to the mounting structure and configured to fixedly couple the one or more resistive heating elements to the mounting structure, and one or more dynamic mounting devices coupled to the mounting structure and configured to automatically compensate for changes in a length of each of the one or more resistive heating elements.

Gas heating device for a vapor deposition system

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Cohoes, NY, United States of America

Patrick Jay Biel