Intersil Americas Inc.

Patrick J Selby

Nikhil Vishwanath Kelkar

Jian Yin

Loyde Milton Carpenter, Jr

Michael W Althar

Nattorn Pongratananukul

Steven R Rivet

A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

Method of fabricating a circuit module

Circuit module such as a high-density lead frame array (HDA) power module, and method of making same

Growing community of inventors

Palm Bay, FL, United States of America

Patrick J Selby