3m Innovative Properties Company

Patrick J Fischer

James J Kobe

Cameron T Murray

Mark David Gehlsen

John James Stradinger

Kenneth Jason Hanley

Ashish Kumar Khandpur

Kenneth J Hanley

In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.

Thermally conducting foam interface materials

In one aspect, the invention provides a method of making a thermal interface material comprising the steps of: (a) providing a polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000; (b) melt-blending the polymer with at least 25 weight percent of a thermally conductive filler to form a mixture; and (c) forming the mixture of hot melt pressure sensitive adhesive and thermally conductive filler as a film. In another aspect, the invention may further comprise the steps of: providing a fire retardant and/or microfiber forming material; and/or irradiating the film with gamma or electron beam (E-beam) radiation or a combination of both to form a thermal interface material.

Thermal interface materials and method of making thermal interface materials

Pressure sensitive adhesive compositions and pressure sensitive adhesive articles containing the adhesive compositions are disclosed. The adhesive compositions of the invention generally demonstrate favorable cohesive strength at elevated temperatures. The adhesive compositions contain an acrylic acid ester copolymer having pendant styrenic polymeric moieties mixed with a polyarylene oxide polymer. The adhesive composition may be a foam.

Pressure sensitive adhesive composition

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Saint Paul, MN, United States of America

Patrick J Fischer