Lucent Technologies Inc.

Patrick J Drummond

James F Dormer

John S Rizzo

Bruce C Abraham

John E Boyd

Daniel Kern

Raymond Frank Gruszka

Jonathan V Haggar

Patrick J Doran

Ping Wu

David J Zangari

A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Apparatus and method for chip processing

A laser bar loading and unloading apparatus is disclosed. The apparatus includes a mounting surface, a movable coating fixture having a plurality of spacers, and at least a first vacuum source for providing a vacuum on a laser bar mounted on the mounting surface. The spacers are movable to place a fully loaded fixture in a closed position and to place an empty fixture in an opened position. A second vacuum source directs a vacuum on a laser bar to assist in moving the laser bar into the fixture and onto one of the spacers. A third vacuum source directs a vacuum on the loaded laser bars to maintain their position in the fixture.

Automated laser bar transfer apparatus and method

A lid guide ensures that a lid is accurately positioned and oriented when it is lowered over and placed onto a tray used to hold electronic devices, for example, for transport between different stages in the manufacturing process, thereby helping to prevent damage to the devices that might otherwise result from physical contact with a lid that is placed onto the tray in a haphazard manner. A lid guide may have one or more openings, each of which may be keyed to restrict the tray and the lid to a single rotational orientation. In addition, channels may be provided in opposing walls of each opening in the lid guide to enable a technician to hold either a tray or a lid between a thumb and a finger when placing the tray onto the lid guide or the lid onto the tray.

Lid guide for electronic devices

Disclosed is a method for fabricating devices so that several devices at a time can be tested and sorted. The devices are placed in a carrier so that each device occupies a discrete position. The carrier includes an identification marker, and each device is identified by its position in the carrier. The carrier is sent to multiple assembly and/or testing stations, and data for each device is collected and stored in a central data base according to its position in the carrier. Each device may then be sorted according to the collected data and its position in the carrier.

Fabrication of semiconductor devices

A method and apparatus for testing of semiconductor chips. The method and apparatus having a fixture which includes electrical contacts and thermal contacts. The electrical contacts are configured to drive each of the chips in an operating or stressed condition. The thermal contacts are configured to maintain the chip at a desired temperature during testing.

Growing community of inventors

Hamburg, PA, United States of America

Patrick J Drummond