Nexperia B.v.

Nxp B.v.

Patrick Houben

Joep Stokkermans

Thomas Markus Kampschreur

Jasper Wesselingh

Gijs Van Der Veen

Theo Ter Steeg

Jozep Stokkermans

The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.

Curved wafer stage

Growing community of inventors

Nijmegen, Netherlands

Patrick Houben