H.c. Starck Gmbh

Daetec. LLC

Materion Newton Inc.

H.c. Starck Solutions Coldwater, LLC

H.c. Stark Inc.

H.c. Starck Place

Patrick Hogan

Shuwei Sun

Gary Alan Rozak

Marc Abouaf

Mark E Gaydos

Paul R Aimone

Francois-Charles Dary

Qi Zhang

John Cleaon Moore

David B Smathers

Michael Thomas Stawovy

Maria Bozena Winnicka

Jared Michael Pettit

Alex Brewer

Helmut Haas

Marcel Hagymasi

Joseph Flanigan

Maria B Winnicka

Mark Abouaf

In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.

Microreactor systems and methods

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

Fabrication of high-entropy alloy wire and multi-principal element alloy wire

In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

Additive manufacturing utilizing metallic wire

In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

Etch chemistries for metallization in electronic devices

Thin-film transistor and method of forming an electrode of a thin-film transistor

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element.

Molybdenum containing targets

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 &#x3bc;m, with at least about 10 percent by weight of particles having a particle size greater than about 150 &#x3bc;m (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 &#x3bc;m), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.

High purity refractory metal powders and their use in sputtering targets which may have random texture

Growing community of inventors

Somerville, MA, United States of America

Patrick Hogan