Precision Connector Designs, Inc.

Minebea Company, Limited

Wells-cti, Inc.

Patrick H Harper

Kurt C Hetzel

Robert W Hooley

Jeffery A Farnsworth

Gregory Martin Chrysler

Yousef M Jarrah

Shen Zhao

Glen Meadows

Christopher Best

Hirofumi Shoji

Thang Ngugen

Robert Harlock

Rex W Keller

Disclosed is a compact and integrated fan, pump, and heat exchanger system where air-cooling is performed via the fan, liquid cooling is performed via a pump, and heat exchange fins in thermal contact with a fluid channel act as a heat exchanger. Heated fluid is carried inside the fluid channel, where heat therein is conducted to the fins. The air flows around the outside surfaces of the fins so that the heat transfers from the heated fluid into the air stream.

Compact air-plus-liquid thermal management module

An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more types of IC packages. A pressure unit is tiltably attached to the lid of the socket device providing a resilient normal force to each of the two or more IC packages without damaging the IC packages. The pressure unit has two or more pressure pads that correspondingly apply the resilient normal force to each of the two or more IC packages. The IC packages are received in recesses where the recesses are typically arranged in an array with the pressure pads in the pressure unit arranged so as to align with the array of recesses.

Multi-site chip carrier and method

A ball grid array socket with rows of electrical contacts that extend through holes in a plate. The arrangement of the holes and the electrical contacts provides an entry hole. The contacts are arranged with ends that are cupped to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted without any interfering structure. The plate is spring loaded is such a way that the plate is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening. This reduced entry opening is arranged and constructed such that with a ball contact insert therein electrical conductivity is provided between the ball contact and the electrical contact, and further where the cupped ends of the electrical contact retain the ball within the hole. The edges of the hole and the top of the cupped electrical contact are chamfered to mate with the curved sides of the ball contact. When force is applied vertically driving the ball contacts into the chamfered edges the hole enlarges allowing the ball to penetrate the hole. As the ball contacts enter deeper into the hole the cupped ends of the electrical contacts ride over the ball such that the ball is retained in a detent fashion. A spring force is provided that is directed to drive the plate and electrical contacts together to reduce the hole. This spring force provides the force necessary to maintain electrical connections between the ball contacts and the electrical contacts of the socket. Pulling the integrated circuit away from the socket over comes the spring force to allow extraction of the integrated circuit. In another embodiment a lever arm is provides that, when activated, drives the plate horizontally compressing the spring and enlarging the entry hole. Releasing the lever arm allows the spring to close and retain the ball grid array integrated circuit. The cupped ends of the electrical contacts are designed to mate with a solid angle at the side/top of the ball contact such that the integrate package is retained within the socket while making electrical connections. The cup is angled to fit on top of the ball and extend between the ball and the IC package such that the ball grid array itself is retained in the socket. In all said arrangements the integrated circuit has unimpeded top entry and exit.

Top loading test socket for ball grid arrays

An integrated circuit carrier system having a carrier frame made up of a plurality of juxtaposed sides and an interior configuration sized to matingly engage an integrated circuit package. The integrated circuit package fits within the frame and is held in position therein by a plurality of locking clips which slidably engage a plurality of top and bottom channels diagonally disposed at each of the corners of the frame. Each locking clip is made up of a substantially C-shaped structure having an uppermost leg and a lowermost leg. The uppermost leg ends in a substantially perpendicularly disposed locking tab and the lowermost leg has a variety of locking arrangements, one of which permits the locking clip to be locked in two locking positions. In one locking position the integrated circuit package is held securely in place while in the other locking position the integrated circuit package may be inserted or removed from the carrier.

Gull-wing IC carrier system

An aligning socket for an IC that provides an aligning bar that aligns and secures IC leads to the corresponding socket contacts (6), and where the bar has extensions or ears (42) that extend toward the row of IC leads (38). The ears have chamfered edges that, as the bar is forced toward the IC leads, guide the IC leads to mate with the socket contacts. For more fragile gull-winged leads, a rail 18 is provided to support the under side of the leads and the alignment bar ears are designed to fit over the ends of the rail. When the bar and socket contacts are forced toward the IC leads, the bar ears overlap the ends of the rail and force any mis-aligned IC leads to move such that alignment of the leads and the socket contacts is achieved.

Aligning IC socket

A system for protecting a gull-wing IC providing a carrier (5) that mates to a programming socket (21) and to a development socket (40). The IC need not be removed from carrier throughout the handling, test/burn-in, programming, and final assembly on the PC board. Moreover, the footprint of the output electrical contacts on the development socket match the footprint of the IC leads, so that the etched PC board pads will accept the IC leads or the development socket output contacts, wherein the assembler may mount the IC using the carrier and the SMT socket or not.

Growing community of inventors

Phoenix, AZ, United States of America

Patrick H Harper