Xerox Corporation

Patrick G Kim

Christopher L Chua

David Kirtland Fork

Linda T Romano

Donald Leonard Smith

Andrew Sebastian Alimonda

A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.

Method and apparatus for interconnecting devices using an adhesive

A spring contact includes a free portion having a tip. The free portion includes a contact surface and side surfaces. In some embodiments, a wear resistant material is formed on only selected portions of the tip. In other embodiments, the wear resistant material is formed on the contact surface and on the side surfaces. The wear resistant material increases the wear resistance of the spring contact. The spring contacts can be used in probes.

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Santa Clara, CA, United States of America

Patrick G Kim