Medtronic, Inc.

Norton Company

Patrick F Malone

Samuel F Haq

Donald P Varner

James E Volmering

Craig L Wiklund

Lynn M Seifried

James Strom

William D Wolf

Mary A Fraley

John H Fortney

David A Ruben

Mark E Henschel

Lary R Larson

William H Gerdes

Scott B Sleeper

Carmine M Doddato

Brian S Child

Joan A O'Gara

Roy L Inman

David Brian Hall

A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

Capacitive filtered feedthrough array for an implantable medical device

The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.

Barrier metallization in ceramic substrate for implantable medical devices

An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body. Each of the first and second multilayer end caps includes conductive elements on one side thereof and further includes conductive traces electrically connected to the conductive elements thereof. Each of the conductive traces of the first and second multilayer end caps terminate at a surface mount contact region along at least one edge thereof. The first and second multilayer end caps are attached to the first and second ends of the device body such that, when the accelerometer device is mounted on a substrate, the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined thereby.

Accelerometer for implantable medical device

Barrier metallization in ceramic substrate for implantable medical

Method of making ceramic substrate

Ceramic substrate for implantable medical devices

The invention relates to catalyst carries for use in conjunction with silver, alkali metal promoters, rhenium promoters and optionally rhenium co-promoters selected from sulfur, molybdenum, tungsten, chromium and mixtures thereof. The carriers consisting of at least 85 and preferably 95 percent by weight of alpha alumina, from about 0.01 to about 6 percent by weight of an alkaline earth metal silicate and from about zero to about 10 percent by weight (measured as the dioxide of added zirconium in the form of an oxide.

Catalyst carrier

Growing community of inventors

Phoenix, AZ, United States of America

Patrick F Malone