Intel Corporation

Patrick Dunaway

Sriram Muthukumar

Charles Christopher Hill

Chandrasekhar Ramaswamy

A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second component. The interconnect may be formed by coating a substrate with photoresist, exposing the photoresist with a defined pattern, developing the photoresist, baking the photoresist at a first temperature for a first amount of time to reflow the photoresist, and baking the photoresist at a second higher temperature for a second amount of time to reflow the photoresist.

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Chandler, AZ, United States of America

Patrick Dunaway