USA As Represented by Secretary of the Navy

Patrick D Riggs

Richard Walter Hirthe

Martin Arthur Seitz

Michael D Frederickson

Alex E Cragoe

Jeff K Latham

Mohammad N Amin

Anthony L Delieto

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, non-linear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

Solder paste and residue

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardwa software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, non-linear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and to statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

Solder paste and residue measurement system

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, nonlinear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

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Greenwood, IN, United States of America

Patrick D Riggs