Oerlikon Assembly Equipment Ag, Steinhausen

Unaxis International Trading Ltd

Esec Ag

Patrick Blessing

Ruedi Grueter

Dominik Werne

Stefan Behler

An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Apparatus for mounting a flip chip on a substrate

The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Method for mounting a flip chip on a substrate

An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.

Growing community of inventors

Thalwil, Switzerland

Patrick Blessing