Schott Ag

Patrick Bartholome

Frank-Thomas Lentes

Andreas Ortner

Fabian Wagner

Albrecht Seidl

Volker Plapper

Simon Schmitt

Antal Makacs

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (&#x3c3;) for separating the substrate along the separation line is smaller than a first reference stress (&#x3c3;) of the substrate and such that an edge strength &#x3c3;of the separation edge obtained after separation is greater than a second reference stress (&#x3c3;) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Method for separating substrates

Growing community of inventors

Jena, Germany

Patrick Bartholome