International Business Machines Corporation

Patrick Anthony Coico

Hilton T Toy

Lewis Sigmund Goldmann

Frank Louis Pompeo

David L Edwards

Peter Jeffrey Brofman

Raymond A Jackson

Kathleen Ann Stalter

Mark G Courtney

Shaji Farooq

Raed A Sherif

James H Covell

Benjamin V Fasano

Madhusudan K Iyengar

Roger R Schmidt

Jeffrey Allen Zitz

David P Graybill

Richard Francis Indyk

William Edward Sablinski

David C Linnell

Ronald L Hering

Gregory Blair Martin

Li Ming Wang

Timothy Joseph Chainer

David Clifford Long

Vinod Kamath

Sushumna Iruvanti

Mark Edward Steinke

Kenneth Charles Marston

Gaetano Paolo Messina

Bejoy J Kochuparambil

Sundar M Kamath

Karl Joseph Puttlitz

Lewis S Goldman

Krishna Gandhi Sachdev

Sudipta Kumar Ray

Steven Paul Ostrander

Michael Sean June

Luc Gilbert Guerin

Michael Berger

Gerard Vincent Weber, Jr

Armando S Cammarano

Eric B Hultmark

Paul A Zucco

Allan R Hoeft

Vladimir Jambrih

Ellyn M Ingalls

Kimberly A Kelly

An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.

Method for controlling airflow of directional flow perforated tile

A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

Directly connected heat exchanger tube section and coolant-cooled structure

A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Method and structure to improve thermal dissipation from semiconductor devices

An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.

Method and structure to provide balanced mechanical loading of devices in compressively loaded environments

An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

Stress resistant land grid array (LGA) module and method of forming the same

A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

Method and apparatus to form a reworkable seal on an electronic module

A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.

Preparing MCM hat for removal

A Land Grid Array electronic package having an array of contact pads is connected to a corresponding array of contact pads on a circuit board through a matching array of conductive pins of a flexible interposer. Alignment of the electronic package to the flexible interposer and flexible interposer to the circuit board is obtained by registration of alignment components to the contact pads and conductive pins. A pair of alignment components, such as pin-like alignment structures, on selected pads of both the electronic package and circuit board mate within alignment holes at the sites of corresponding pin locations in said flexible interposer. Alternatively, the pin-like alignment structures on the electronic package can be extended to pass through the said alignment holes of said flexible interposer into alignment holes which replace the pin-like alignment structure on said circuit board.

Land grid array alignment and engagement design

An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.

Compliant leads for area array surface mounted components

A one step method for curing encapsulant and joining Ball Grid Array (BGA) solder balls comprises curing an encapsulant material simultaneously with the joining of the eutectic material of the apparatus whether that eutectic material is a solder paste or preform, the balls being of a higher melt material or the balls themselves being an eutectic material. The method performs both functions in one pass through a furnace avoiding the separate and time consuming encapsulant and/or underfill curing step.

One step method for curing and joining BGA solder balls

A method and structure for manufacturing semiconductor devices comprising providing a chip and a substrate, aligning the chip and the substrate, attaching the chip to the substrate and optionally verifying chip/substrate alignment, the aligning comprising providing at least one chip alignment mark on a first side of the chip (wherein the chip alignment mark corresponds to chip pads on a second side of the chip) and aligning the alignment mark with substrate pads on the substrate.

Optical sensing method to place flip chips

A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Solder disc connection

Growing community of inventors

Fishkill, NY, United States of America

Patrick Anthony Coico