Asml Netherlands B.v.

Patricius Jacobus Neefs

Ruud Hendrikus Martinus Johannes Bloks

Thibault Simon Mathieu Laurent

Johan Gertrudis Cornelis Kunnen

Rogier Hendrikus Magdalena Cortie

Adrianus Hendrik Koevoets

Jim Vincent Overkamp

Christianus Wilhelmus Johannes Berendsen

Putra Saputra

Michael Johannes Hendrika Wilhelmina Renders

Johannes Petrus Martinus Bernardus Vermeulen

Frederik Eduard De Jong

Stoyan Nihtianov

Siebe Landheer

Kofi Afolabi Anthony Makinwa

Johannes Cornelis Paulus Melman

Chung-Hsun Li

Georgios Tsirogiannis

John Maria Bombeeck

Ronald Frank Kox

Hendrik Cornelis Anton Borger

Si-Han Zeng

Pieter Jeroen Johan Emanuel Hoefnagels

Johannes Paul Marie De La Rosette

A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.

Method and system for determining overlay

A lithographic apparatuscomprisingincludesan object tablewhich carries an object. The lithographic apparatus may furthercomprise at least oneinclude asensoras part of a measurement systemto measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimatetheadeformation oftheanobject due toavaryingloadsloadduring operation of the lithographic apparatus, for exampleavaryingloadsloadinduced by a two-phase flow in a channel formedwithinofthe object table.Additionally, or alternatively, theThelithographic apparatuscomprisesmay includea predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used toprovide apatterna substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.

Lithographic apparatus and an object positioning system

A device manufacturing method includes: confining a liquid to an immersion space between a projection system and an object; starting application of an underpressure to an extraction unit to remove fluid from a position proximate an edge of the object before the immersion space moves onto the object; moving the support table along a route comprising a series of motions such that a plurality of target positions on the object pass under the projection system; projecting through the immersion space a beam onto the target portions as the target portions pass under the projection system, the projecting performed to account for a certain predetermined thermal profile in the object; and stopping application of the underpressure at a predetermined time after the immersion space moves off the object for the last time during the series of motions to at least partly induce the certain predetermined thermal profile in the object.

Lithography apparatus and a method of manufacturing a device

A measurement substrate for measuring a condition pertaining in an apparatus for processing production substrates during operation thereof, the measurement substrate including: a body having dimensions compatible with the apparatus; a plurality of sensor modules embedded in the body, each sensor module having: a sensor configured generate an analog measurement signal, an analog to digital converter to generate digital measurement information from the analog measurement signal, and a module controller configured to output the digital measurement information; and a central control module configured to receive the digital measurement information from each of the module controllers and to communicate the digital measurement information to an external device.

Measurement substrate and a measurement method

A lithographic apparatus comprising an object table which carries an object. The lithographic apparatus may further comprise at least one sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the deformation of the object due to varying loads during operation of the lithographic apparatus, for example varying loads induced by a two-phase flow in a channel formed within the object table. Additionally, or alternatively, the lithographic apparatus comprises a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used to pattern a substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.

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Raamsdonksveer, Netherlands

Patricius Jacobus Neefs