Texas Instruments Corporation

Patricio Vergara Ancheta, Jr

Ramil Alfonso Viluan

Heintje Sardonas Vilaga

James R M Baello

Elaine B Reyes

Ella Chan Sarmiento

Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed wafer surface positioned below the center of gravity of the wafer such that prevailing force of gravity may be used to assist in the removal of contaminants from the wafer.

Method for sawing semiconductor wafer

A semiconductor device with a chip (), its position defining a plane, and an insulating substrate () with first and second surfaces; the substrate is substantially coplanar with the chip, without warpage. One of the chip sides is attached to the first substrate surface using adhesive material (), which has a thickness. The thickness of the adhesive material is distributed so that the thickness () under the central chip area is equal to or smaller than the material thickness () under the peripheral chip areas. Encapsulation compound () is embedding all remaining chip sides and the portions of the first substrate surface, which are not involved in the chip attachment. When reflow elements () are attached to the substrate contact pads, they are substantially coplanar with the chip.

Growing community of inventors

Baguio, Philippines

Patricio Vergara Ancheta, Jr