Texas Instruments Corporation

Patricia Sabran Conde

Vikas I Gupta

Rajiv Carl Dunne

Michael Todd Wyant

Emerson Mamaril Enipin

A method of making a stacked semiconductor package having at least a leadframe, a first die mounted above and soldered to the lead frame and a first clip mounted above and soldered to the first die. The method includes positioning the leadframe, first die and first clip in a vertically stacked relationship and nonsolderingly locking the first clip in laterally nondisplaceble relationship with the leadframe. A stacked semiconductor package and an intermediate product produced in making a stacked semiconductor package are also disclosed.

Growing community of inventors

Pasig, Philippines

Patricia Sabran Conde