Hewlett-packard Company

Patricia S Brown

Arthur King Wilson

Jason R Arbeiter

Gary M Nobel

Todd R Medin

W Wistar Rhoads

Corrina A Hall

An inkjet printer including a first inkjet pen having a first electrical contact and a second inkjet pen having a second electrical contact the improvement which includes: a substrate; a third electrical contact on the substrate coupled to the first electrical contact on the first inkjet pen; a fourth electrical contact on the substrate coupled to the second electrical contact on the second inkjet pen; and a conductive layer deposited on the substrate electrically interconnecting the third electrical contact to the fourth electrical contact. The improved unitary interconnect system provides an interconnect system that reduces cost, is easier to assemble and align, and provides ground plane sharing for all of the inkjet pens.

Unitary interconnect system for an inkjet printer

A versatile flexible interconnect circuit for use with an inkjet printer. The inventive flexible interconnect circuit comprises a unitary flexible substrate having a first end and a second end. A first plurality of contacts is arranged on the first end of the substrate in a first configuration. A first plurality of conductive traces connects the first plurality of contacts to a second plurality of contacts disposed on the second end of the substrate. A third plurality of contacts is arranged on the first end of the substrate in a second configuration. A second plurality of conductive traces connects the third plurality of contacts to a fourth plurality of contacts disposed on the second end of the substrate. In a specific embodiment, the first plurality of contacts includes plural electrical ground contacts and the first plurality of conductive traces includes a conductive trace which connects the electrical ground contacts. The inventive flex circuit allows for the use of pens with different contact configurations in a single inkjet printer.

Flex circuit with multiple trace configurations and method of manufacture

An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on a protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts on the protrusions on the flexible first layer and the corresponding electrical contacts on the second layer are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer and the second layer and the spring apparatus for aligning the flexible first layer with the second layer and the spring apparatus. The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

Electrical interconnect system for a flexible circuit

An apparatus and method for providing proper electrical contact between corresponding interconnect pads of a print cartridge and a print carriage are disclosed. One end of a flex circuit having interconnect pads of the print carriage is attached to one side of the print carriage while the other end of the flex circuit may be substantially free or attached to an opposing side of the print carriage. When the print cartridge is initially inserted into the print carriage, a gimbal spring causes the flex circuit interconnect pads to preliminarily come in contact with the print cartridge interconnect pads before the print cartridge is completely inserted. As the print cartridge is further inserted, the print cartridge pushes out any excess slack in the flex circuit while providing a wiping action between the interconnect pads of the print cartridge and the flex circuit. This wiping action between the interconnect pads scrapes away any contaminants and corrosion, thus ensuring reliable electrical contact.

Wiping structure for cleaning electrical contacts for a printer and ink

An improved interconnect system for an inkjet printer. The inventive interconnect system includes first and second unitary flexible circuits having first and second sets of contacts, respectively, for providing first and second electrical interconnections, respectively. The first and second flexible circuits are aligned and retained so that contacts thereon engage corresponding contacts disposed on a rigid support. In a specific implementation, the first flexible circuit is aligned by a first set of pins arranged along a first axis and the flexible circuit is aligned by a second set of pins arranged along a second axis, perpendicular to the first axis. This arrangement allows for the alignment and mounting of two flexible circuits on a single printer carriage without a substantial increase in the width thereof. The first flexible circuit may be used to connect the inkjet pens to the electronic drive circuit and the second flexible circuit may be used to connect a paper sensor or other device to the electronic circuit.

Electrical interconnect system for multiple flexible circuits

An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on the protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts on the protrusions on the flexible first layer and the corresponding electrical contacts on the second layer are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer and the second layer and the spring apparatus for aligning the flexible first layer with the second layer and the spring apparatus. The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

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Encinitas, CA, United States of America

Patricia S Brown