Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Freescale Semiconductor,inc.

Michelin Recherche Et Technique S.a.

Politecnico Di Milano

Commissariar Á L'energie Atomique at Aux Energies Alternatives (cea)

Nxp Usa, Inc.

Societe Detechnologie Michelin

Patrice Rey

Guillaume Jourdan

Philippe Robert

Emmanuel Defay

Loic Joet

Lianjun Liu

Francois Perruchot

Thierry Verdot

Sergio P Pacheco

Gilles Delapierre

Loïc Joet

Bernard Diem

Hubert Bono

Franck Badets

Giacomo Langfelder

Arnaud Walther

Hubert Grange

Laurent Jouanet

Haykel Ben Jamaa

Patrick Agnese

Dirk Ettelt

Valery Poulbot

France Michel

Yannick Deimerly

François Perruchot

Matthieu Cueff

Antonio F Longoni

Stefano Dellea

Mouna Salhi

A mechanical coupling device coupling in movement two elements able to move in translation along a first direction, configured to impose thereon movements in phase opposition, the coupling device including two arms rotationally articulated about a second out-of-plane direction, each arm to be connected to one of the movable elements, a coupling element to which the two arms are connected by elements having high rigidity in a third direction, the coupling element being configured to move in translation along the third direction, first and second devices for suspending the coupling element configured to guide the coupling element in translation along the third direction and to limit rotational movement thereof about the second direction.

Coupling device intended to couple two elements in movement

A mechanical link for microelectromechanical and/or nanoelectromechanical structure, includes a mobile component, a fixed component extending on a plane, and apparatus for detecting displacement of the mobile component relative to the fixed component. The mechanical link includes: a first link to the fixed component and mobile component, allowing rotation of the mobile component relative to the fixed component about an axis of rotation; a second link connecting the mobile component to the detection apparatus at a distance and perpendicular to the axis of rotation; a third link to the fixed component and detection apparatus, guiding the detection apparatus in a direction of translation in the plane; wherein the combination of the second link and third link can transform rotational movement of the mobile component into translational movement of the detection apparatus in the direction of translation. The detection apparatus includes a piezoresistive/piezoelectric strain gauge, resonance beam, capacitance, or combination thereof.

Mechanical link for MEMS and NEMS mechanical structure, and MEMS and NEMS structure comprising such a mechanical link

A hinge for a micromechanical and/or nanomechanical structure includes: a support, and a movable part in an out-of-plane direction. The hinge allows for the out-of-plane displacement of the movable part. The hinge further includes two torsion beams extending along the axis of rotation of the hinge, two bending elements mechanically connecting the movable part and the support and having at least one pair of a first and of a second beam parallel with each other and extending in a plane perpendicular to the axis of rotation, the first beam being connected to the support and the second beam being connected to the movable part, the first and second beams being connected to one another by a first connecting element at a longitudinal end, the two beams extending in the same direction from the first connecting element.

Hinge offering a reduced sensitivity to internal stresses

A hinge between a support and a movable part in an out-of-plane direction of a microelectromechanical structure includes two torsion beams, and two bending elements connecting the movable part and the support and each comprising two beams extending perpendicularly to the axis of rotation. Each beam is connected to the support by a first end and to the movable part by a second end, the first ends and the second ends of the beams being disposed with respect to one another in such a way that the orientation of the first end towards the second end of one beam is opposite to the orientation of the first end towards the second end of the other beam.

Out-of-plane hinge for a micromechanical and/or nanomechanical structure with a reduced sensitivity to internal stresses

Piezoresistive detection resonant device comprising a substrate, a mobile par configured to move with respect the substrate, suspension elements suspending the mobile part to the substrate, a piezoresistive detection device to detect the motions of the mobile part, said piezoresistive detection device comprising at least one strain gauge, wherein the piezoresistive detection resonant device also comprises a folded spring with at least two spring arms, connected to the mobile part and configured to be deformed by the motion of the mobile part, the at least one gauge being suspended between the substrate and the folded spring in such manner that the deformation of the gauge is reduced compared to the motion of the mobile part.

Piezoresistive detection resonant device in particular with large vibration amplitude

Microelectromechanical sensor with an out-of-plane detection has a cross sensitivity in a first direction in the plane with a value of S, the sensor comprising a support, a mass suspended from the support by beams stressed by bending, in such a way that the inertial mass is capable of moving with respect to the support about an axis of rotation contained in a plane of the sensor, a stress gauge suspended between the mass and the support. The bending beams have a dimension tin the out-of-plane direction and the mass has a dimension tin the out-of-plane direction such that Lis the distance between the centre of gravity of the mass and the centre of the bending beams projected onto the first direction.

Microelectronic sensor device with an out-of-plane detection having a controlled cross sensitivity

A method for encapsulation of microelectronic components includes making a portion of sacrificial material on a front face of a first substrate in which the component is to be made. The method then includes making a cover encapsulating the portion of sacrificial material, and making the component by etching the first substrate from its back face. The etching is such that part of the component faces the portion of the sacrificial material, and such that the portion of sacrificial material is accessible from a back face of the component. The method then includes eliminating the portion of the sacrificial material by etching from the back face of the component, and securing the back face of the component to a second substrate.

Method of encapsulating a microelectronic component

A measuring circuit for a multisensory detector is provided, including a plurality of detection branches mounted in parallel, with each detection branch of said plurality of detection branches including at least two dipoles mounted in series, and at least one reference branch, including a polarizing source and another at least two dipoles mounted in series, with the reference branch being connected in parallel to at least two detection branches among the plurality of detection branches, so as to form a Wheatstone bridge with each one of the detection branches among the plurality of detection branches.

Multisensory detector

Electrical connection device comprising at least one substrate and one or several first electrical connection elements located on a front face of the electrical connection device such that they can be coupled to contact pads of an electronic device to which the electrical connection device is intended to be connected, each first electrical connection element comprising:

Electrical connection device comprising connection elements with controllable position

A measurement circuit for a sensor, the measurement circuit includes at least one detection branch including at least a first series of at least one dipole and a second series of at least one dipole, the series being connected in parallel and connected at their inputs to a common input terminal, each series of dipole being connected to a distinct output terminal, and an electronic circuit including a bias circuit configured to apply a bias current to the detection branch from the input terminal, and a read circuit configured to impose on each output terminal the same potential referred to as the 'reference potential' (V); the electronic circuit including a determination circuit for determining variations in impedances of each series of dipole of the detection branch on the basis of the current applied to each output terminal by the read circuit so as to keep the potentials equal.

Measurement circuit

Inertial sensor comprising a fixed part and at least one mass suspended from the fixed part and means of damping the displacement of the part suspended from the fixed part, said damping means being electromechanical damping means comprising at least one DC power supply source, one electrical resistor and one variable capacitor in series, said variable capacitor being formed partly by the suspended part and partly by the fixed part such that displacement of the suspended part causes a variation of the capacitance of the variable capacitor.

Microelectromechanical and/or nanoelectromechanical structure with a variable quality factor

A mechanical connection between two parts of a microelectromechanical and/or nanoelectromechanical structure forming a pivot with an axis of rotation pivot includes two first beams with an axis parallel to the pivot axis, the first beams configured to work in torsion, and two second beams with an axis orthogonal to the axis of the first beams, the second beams configured to work in bending, each one of the first and second beams being connected at their ends to the two parts of the structure.

Mechanical connection forming a pivot for MEMS and NEMS mechanical structures

A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.

Electromechanical transducer device and method of forming a electromechanical transducer device

A triaxial force sensor including: a deformable membrane; a detector detecting a deformation of the membrane configured to carry out a triaxial detection of the force to be detected; and an adhesion mechanism disposed at least at one of the principal faces of the deformable membrane, configured to secure the one of the principal faces of the deformable membrane to at least one elastomer material to be acted upon by the force to be detected, and distributed uniformly at a whole of the surface of the one of the principal faces of the deformable membrane, the deformable membrane being disposed between a cavity and the elastomer material.

Contact force sensor with an elastomer material secured to a deformable membrane

A method of forming an electromechanical transducer device comprises forming on a fixed structure a movable structure and an actuating structure of the electromechanical transducer device, wherein the movable structure is arranged in operation of the electromechanical transducer device to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing a stress trimming layer on at least part of the movable structure, after providing the stress trimming layer, releasing the movable structure from the fixed structure to provide a released electromechanical transducer device, and after releasing the movable structure changing stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure is deflected a predetermined amount relative to the fixed structure when the electromechanical transducer device is in an off state.

Growing community of inventors

St Jean de Moirans, France

Patrice Rey