Nxp B.v.

Koninklijke Philips Corporation N.V.

St-ericsson Sa

Tessera Advanced Technologies, Inc.

Patrice Gamand

Olivier Tesson

Philippe Maugars

Freddy Roozeboom

Pascal Philippe

Jean-Marc Yannou

Fabrice Verjus

Antonius Lucien Adrianus Maria Kemmeren

Marc Sworowski

Adrianus Alphonsus Jozef Buijsman

Gerardus Tarcisius Maria Hubert

Lucie A Rousseville

Sidina Wane

Dominique Yon

Cyrille Cathelin

Philippe Descamps

Alain De La Torre

Benoît Butaye

Sebastien Jacqueline

Phillipe Maugars

A multi-beam-former for an antenna array is described, the multi-beam former comprises N transceiver terminals for connecting a transmitter and/or receiver and N antenna terminals for connecting to a respective antenna and a plurality of couplers and matrix phase shifters arranged in an N&#xd7;N Butler matrix configuration between the N transceiver terminals and the N antenna terminals. At least some of the matrix phase shifters include a switchable matrix phase shifter configured to switch between a respective first phase shift value and a respective second phase shift value; a plurality of bypassable phase shifters arranged between at least some of the couplers and the antenna terminals and configured to switch between a respective further phase shift value and a zero phase shift. The multi-beam former is operable to select one of M different beam angles for a signal, wherein M is greater than N.

Multi beam former

An integrated circuit for a packaged device is proposed. The circuit comprises: a circuit having first and second electromagnetic radiating elements fabricated on a die; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board. The die is mounted on the upper surface of the package substrate. The grounding layer comprises a void, at least a portion of the void being positioned so as to at least partially electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element.

Integrated circuit

A wireless mobile communication device having short range functionality that is designed to always be capable of short range functionality, including secure short range functionality by having a first and second energy source where charging of the second energy source may be achieved by the voltage induced by the received short range signal.

Wireless mobile communication device having an ensured short range functionality

A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.

Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect

A Lange coupler comprises an unbroken peripheral ground conductor surrounding input, through, coupled and isolated conductor strips coupled to input, through, coupled and isolated ports of the Lange coupler respectively, wherein the peripheral ground conductor and input and through conductor strips are arranged on a first metal layer.

Lange coupler and fabrication method

The present invention relates to a method and system for testing integrity of a passivation layer () covering a semiconductor device. A structured layer of electrically conducting material () is deposited onto at least a portion of a top surface of a substrate () of the semiconductor device. The structured layer () comprises a plurality of bands () connected to at least two contacts () and disposed on the at least a portion of the top surface such that one of consecutive bands () and consecutive portions of the bands () are connected to different contacts (). A passivation layer () is deposited onto the at least a portion of the top surface of the substrate () and the structured layer () such that material of the passivation layer() is disposed between the bands of conducting material () and on top of the structured layer (). Electrically conducting material is then deposited onto the passivation layer () and a resistance is measured between the at least two contacts (). An indication with respect to integrity of the passivation layer () is determined in dependence upon the measured resistance.

Embedded structure for passivation integrity testing

A wireless mobile communication device having NFC functionality that is designed to always be capable of NFC functionality, including secure NFC functionality by having a first and second energy source where charging of the second energy source may be achieved by the voltage induced by the received NFC signal.

Wireless mobile communication device having an ensured NFC functionality

The invention provides a method for ensuring a secure NFC functionality of a wireless mobile communication device comprising the steps of detecting the charge state of a first energy source () which supplies the voltage for operating the wireless mobile communication device (S); switching off the first energy source and switching on a second energy source (), if the detected charge state of the first energy source () falls below a threshold (S); detecting the charge state of the second energy source (), if an external NFC signal is received (S); charging of the second energy source via voltage induced by a received NFC signal to allow at least one secure NFC transaction, if the detected charge state of the second energy source () is below a threshold (S). Furthermore the invention provides a wireless mobile communication device having a secure NFC functionality, which is always ready for operation of at least the secure NFC functionality.

Method for ensuring a secure NFC functionality of a wireless mobile communication device and wireless mobile communication device having a secure NFC functionality

An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ) of a printed circuit board (PCB), and a passive integration substrate (S) set on top of the digital and/or analog integrated circuit (S) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and &#xcb;i) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

An antenna device (AD) for a RF communication equipment, comprises i) a substrate (S) comprising front (FS) and back (BS) sides, ii) a planar antenna element (AE) fixed to the substrate back side (BS), iii) a group of at least one component (G) fixed to the substrate front side (FS), in an area located under the antenna element (AE), and connected to the antenna element (AE) through at least a first connecting means (VH) passing through the substrate (S), and a low resistivity layer (BL) buried into the substrate (S) for connecting to ground in order to isolate at least the group of component(s) from electromagnetic disturbances induced by the antenna element (AE).

Antenna device and RF communication equipment

The present invention relates to a tunable filter device for providing a tunable band pass characteristics for the receive path of a multi-band front-end module. According to the invention is proposed, a distributed, wide-band amplifier with a low-frequency cut-off and a high-frequency cut-off in combination with a LCR network, of which wide-band amplifier the DC blocking capacitors define the low-frequency cut-off of the filter device, whilst the high-frequency cut-off is determined by the cut-off frequency of the artificial input and output transmission lines of the LCR network. In one embodiment, additional capacitors are coupled in parallel to the DC blocking capacitors of the LCR network, switchable by MOS transistors as switching elements. Accordingly, in a certain embodiment it is proposed to allow tuning of the low- and the high-frequency cut-off by programming with a digital control command.

Tunable multi frequency bands filter device

The invention relates to a MEMS resonator having at least one mode shape comprising: a substrate () having a surface (), and a resonator structure (), wherein the resonator structure () is part of the substrate (), characterized in that the resonator structure () is defined by a first closed trench () and a second closed trench (), the first trench () being located inside the second trench () so as to form a tube structure () inside the substrate (), and the resonator structure () being released from the substrate () only in directions parallel to the surface (). The invention further relates to a method of manufacturing such a MEMS resonator.

MEMS resonator having at least one resonator mode shape

The present invention relates to a method of manufacturing a resonator within a semiconductor device, said semiconductor device comprising a substrate, wherein said method comprises the steps of: etching a hole in the substrate, creating a first doping zone (Z-DIFF) for defining a first electrode, partitioning said first electrode into two electrodes, applying a delimited oxide deposit inside and around the hole, defining a second doping zone (Z-DIFF) totally covering the hole, removing the oxide deposit in order to define an element forming the resonator able to vibrate between the two electrodes.

Semiconductor device with a resonator

To isolate at least one electric or electronic element (), for example an interconnection integrated onto a semiconductor substrate (), this device comprises at least one isolation means chosen from an isolating layer () extending in the substrate and an assembly whose height exceeds that of the element and which comprises, on either side of the element, at least two superposed conductors (), which are integrated into the substrate and extend along the element.

Integrated electromagnetic shielding device

An integrated circuit including a substrate, a conductive layer, at least one inductive element superposed on the conductive layer and formed by a metallic turn having an outer contour and an inner contour, which bound between them a surface referred to as the radiation surface, and insulating material for insulating the conductive layer from the inductive element. The conductive layer has a surface substantially identical to the radiation surface.

Growing community of inventors

Douvres la Delivrande, France

Patrice Gamand