Safran Electronics & Defense

Patrice Chetanneau

François Guillot

Francois Guillot

Pascal Spoor

Olivier Leborgne

A measurement transformer includes a printed circuit and a magnetic core. The printed circuit includes an insulating layer, a primary through assembly and a secondary through assembly. The primary through assembly includes first primary plated through holes and second primary plated through holes extending through the insulating layer. The primary through assembly forms a portion of a primary winding of the transformer. The primary winding has a single turn. The secondary through assembly includes first secondary plated through holes and second secondary plated through holes extending through the insulating layer. The secondary through assembly forms a portion of a secondary winding of the transformer. The secondary winding includes a plurality of turns connected in series. The magnetic core extends in the thickness of the printed circuit.

Measurement transformer including a printed circuit board

A connection system for exchanging electrical signals includes a first symmetrical connector and a second symmetrical connector. Each symmetrical connector has at least one magnetic core provided with at least one turn. The symmetrical connectors are produced in a substrate made of insulating material so as to form a half of a coupling transformer. At least one half of the coupling transformer of each connector is arranged opposite one another so as to be able to exchange a magnetic flux. The electrical signals are emitted by the first connector in the form of a magnetic flux, and the second connector generates the electrical signals on receiving the magnetic flux.

Connection system for exchanging electrical signals with magnetic symmetrical connectors

A printed circuit includes a first track, a second track, and at least one insulating layer extending between the first track and the second track. The printed circuit further includes a first through assembly of at least one first plated through hole and a second through assembly of at least one second plated through hole. Each first plated through hole and each second plated through hole connect together the first track and the second track by extending through the insulating layer. The first through assembly and the second through assembly respectively form a first branch and a second branch of a current divider bridge.

Printed circuit board incorporating a current divider bridge

An electrical connection assembly including two complementary connectors, each including a mutually parallel electrically insulating plates each comprising one face carrying signal transport contacts and an opposite face carrying at least one shielding sheet in such a manner that, when the connectors are connected together, the plates are interleaved between one another so that the contacts are pressed against one another and the shielding sheets are pressed against each other.

Electrical connection assembly with high density of contacts

A flux gate current sensor includes a magnetic core, a measurement winding, an excitation circuit arranged to generate a digital excitation signal, an acquisition circuit arranged to acquire an analog measurement voltage from the terminals of the measurement winding and to produce a digital measurement signal, a demagnetization servocontrol circuit arranged to use the digital measurement signal to produce a digital demagnetization signal for compensating magnetic flux produced by the current that is to be measured, a summing circuit arranged to sum the digital excitation signal and the digital demagnetization signal so as to obtain a digital injection signal, and an injection circuit arranged to produce an analog excitation current from the digital injection signal and to inject the analog excitation current into the measurement winding.

Current sensor with flux gate

A process for producing a backplane circuit board () having an internal face () adapted to be connected to connectors () of circuit boards () and an external face () adapted to be connected to an external connector (), blind holes () opening on the internal face () and external face () of the backplane circuit board (), wherein bonding layers () having zones () cleared of material facing the blind holes are used between the printed circuits ().

Method for producing a backplane circuit board

The invention relates to a pressure measurement device () comprising: The invention also relates to a measurement system including such a measurement device.

Device for measuring and system for measuring a pressure comprising a pressure sensor

A pressure measurement device includes a pressure sensor including a printed circuit card having a portion that is to be subjected to pressure for measurement. The printed circuit card has strain detectors mounted on the portion to measure deformation of the printed circuit card under the influence of the pressure. The device may be included in a measurement system.

The present invention concerns a backplane electronic board () having on inner face () suitable for being connected to electronic board connectors () and an outer face () suitable for being connected to an outer connector (), the backplane board () being characterized in that it has blind holes opening on the inner face () of same, and holes opening on the outer face () of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.

Growing community of inventors

Paris, France

Patrice Chetanneau