International Business Machines Corporation

Pat Gallarelli

Martin Joseph Crippen

Timothy Andreas Meserth

William Laird Dungan

David John Jensen

Eric Adams

Kevin Duane Johnson

Matthew Scott Henry

Ravi Shankarnarayan Adapathya

Todd W Justus

Mark John Lawrence

Lisa Michele Vizer

Arvind Kumar Sinha

Vinod Kamath

Brian Michael Kerrigan

Daniel Paul Kelaher

Charles Albert Rudisill

Richard M Barina

Robert Edward Steinbugler

Derek Ian Schmidt

Kevin Hunter Vorhees

Seth David Lewis

Anthony Wayne Miles

Joel Edwin Walker

Benjamin Michael Kreuz

Mark S Bohannon

J Scott Womble

Kevin P Goffinet

Dale R Flower

An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Retention module for toolless heat sink installation

A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

Low profile computer processor retention device

A dual member handle system and method of operating the same. The system includes a body, a first handle rotably attached to the body, and a second handle rotably attached to the body. The first handle is attached adjacent the second handle. The first handle rotates about a first axis and the second handle rotates about a second axis that is different from the first axis. The method includes rotating a first handle about a first axis and rotating a second handle, while rotating the first handle, about a second axis. The second axis is adjacent to and different from the first axis.

Dual member handle system and method of operating the same

A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

System and method for installing and retaining I/O connector without tools

A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.

Dissipating heat reliably in computer systems

An electronic circuits module includes a cover and a base. A lever and cam assembly is rotatably attached to the cover, and the cam includes first and second lobes. The lever and cam assembly is rotatable between first, second and third positions. In the first position, the first lobe can be inserted through an eccentric opening in the base, and then rotated to the second position to lock the cover to the base. In the third position, the module can be inserted into the computer and when the lever and cam assembly is moved back to the second position, the second lobe locks the module in the computer. A mechanism in the computer inhibits the movement of the lever and cam assembly into the first position, thereby preventing the disconnection of the base from the cover when the module is installed in the computer.

Computer module with integrated cover latching and attachment mechanism

A method and structure for managing computer hardware cable media is provided, featuring a support having a frontal face, at least one flange, and at least one curved surface projecting from the support frontal face for receiving and guiding cable media. The curved surface has a radius sufficiently large enough to receive and redirect cable media by bending the cable media without cracking or causing other damage to the cable media. The flange is connected to a computer rack system rail so that support is overlapping at least one hardware component connected to the computer rack system, thereby allowing a portion of the rack space occupied by the flange and the support to be utilized by other hardware components, increasing the effective usable space of the rack system. Cable media are received onto the curved surface, redirected by bending along the curved surface, and ultimately distributed in discrete bundles of cable media to hardware devices. The discrete bundles of cable media are spaced from any other cable media, so that the bundle of cable media may be disconnected from its associated hardware device or otherwise manipulated by hand without disturbing any other cable media.

Cable management device for mixed media

Computer system having removable and stackable modules

An equipment enclosure insludes identical top and bottom portions each made from a single sheet of sheet metal, and a front panel and rack tube assembly wherein the front panel is made and stamped from a single sheet of sheet metal while the remaining tube assembly comprises the other three sides of the enclosure and is also produced from a single sheet of sheet metal. Left and right side plates may be fastened to the sides of the tube assembly to allow for various mounting configurations.

Equipment enclosure

A touch sensing direct input data display device is described. The data display screen is directly and solely supported within a housing by stiff springs having essentially uniaxial freedom of motion. Strain gauge sensors are applied directly to the springs and are connected in a full Wheatstone bridge sensing circuit. The outputs of the sensors are fed to a calculating and processing device for calculaating the X, Y and Z coordinate information relative to the point on the face of the display which has been pushed or touched. The Z component is of total force and the X any Y components give the two dimensional location for the application of the force measured in the Z axis. The stiff springs allow very little deflection to occur under normal touch imposed fores on the display screen. They permit essentially uniaxial motion only in the Z axis. The system is mechanically robust and may be shipped and subjected to dropping or impact loads normally encountered in shipping without damage, has a relatively high natural frequency of vibration and produces high level, relatively continuous output signals for use.

Touch sensing display screen apparatus

Growing community of inventors

Chapel Hill, NC, United States of America

Pat Gallarelli