Compaq Computer Corporation, Inc.

Hewlett-packard Development Company, L.p.

Pasha S Mohi

Stacy L Wolff

Neil L Condra

Chi-Tsong Chu

Gregory J Mora

Chris F Felcman

Steven S Homer

James Scott Love

Chris F Feleman

A computer device comprises a calibration module adapted to detect an input frequency for at least one input mode of a digitizer device. The calibration module is configured to determine whether the input frequency is within a frequency tolerance band corresponding to the at least one input mode.

Computer device with digitizer calibration system and method

A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components&mdash;namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor&mdash;are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board. with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.

Multi-drive portable computer

A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components&mdash;namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor&mdash;are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of-cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.

Multi-drive portable computer having a plurality of heat sink members therein

A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components&mdash;namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor&mdash;are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board, with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.

A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components--namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor--are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board, with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.

Growing community of inventors

Houston, TX, United States of America

Pasha S Mohi