Corning Incorporated

Corning S.a.

Pascale Laborde

Pushkar Tandon

Heather Debra Boek

Jean-Pierre Themont

William Paul Ryszytiwskyj

Christian Lerminiaux

Alain M Beguin

Elizabeth A Boylan

Haibo Huang

Patrice Camy

Daniel L G Ricoult

Gary L Lewis

Methods of forming plasma addressed liquid crystal display ribs are disclosed. An exemplary method includes introducing a glass paste which includes a curable medium into cavities formed in an intaglio collector to define rib structures, which are from the collector to a surface of the substrate, and removing the curable medium from the rib structures on the substrate surface to generate pores in the rib structures. The substrate having rib structures is then dipped into a solution containing an opaque pigment which is absorbed into the rib structure. Another method includes forming a temporary mask on portions of a surface of a substrate, depositing a layer of a glass paste having a curable medium and at least one pigment blended therein over the substrate and temporary mask, micro-molding rib structures from the glass paste on the substrate surface in areas between the masked sections, removing any residual layer of paste material present on the temporary mask, removing the temporary mask from the substrate, and firing the substrate with micro-molded rib structures thereon.

Method for making display panels with opaque rib structures

Phosphate free, Er/Yb co-doped borosilicate glass compositions and optical devices made from said compositions are disclosed; said compositions comprising, for 100 parts by weight of: 60 to 70 parts by weight SiO or SiO &plus;GeO with SiO always being greater than 40 parts by weight, 8 to 12 parts by weight of B O , 10 to 25 parts by weight M O wherein M O is an alkali metal oxide, 0 to 3 parts by weight of BaO, 0.1 to 5 parts by weight Er O , and from 0.1 to 12 parts by weight of Yb O and from 0 to less than 5 parts by weight F; and within which, the boron atoms are of tetrahedral spatial coordination.

Glass composition and optical device made therefrom

The principal object of the present invention is organic lens molds, constituted wholly or in part of at least one specific inorganic glass, advantageously strengthened by a chemical tempering or a thermal tempering. Said glass has the following composition, expressed in percentages by weight: SiO 56-66, Al O 2.5-10, B O 0.5-7, Li O 0-3, Na O 8-15, K O 3-12, with Li O&plus;Na O&plus;K O 12-20, ZnO 2-12, MgO 0-3, TiO 0-0.5, ZrO 1-9, CaO 0-1, BaO 0-2, SrO 0-2, with MgO&plus;CaO&plus;SrO&plus;BaO 0-5, Cl 0-0.5, As O &plus;sb O 0-1. The invention also deals with novel inorganic glasses which have the above composition with a single exception relative to the Al O content: Al O 2.5-4.

Organic lens molds in inorganic glass and novel inorganic glasses

A lead silicate glass frit composition particularly useful for the formation of dielectric layers and barrier ribs in plasma display panels.

Crystallizing glass frit composition for forming glass rib structures

A method and apparatus for the flame hydrolysis deposition (FHD) of a core material on a substrate provides a holder for a substrate which is heated to a predetermined temperature selected to maintain the substrate temperature relatively constant during the FHD process. As a result, the thickness of a thin film applied to the substrate is relatively uniform as is the index of refraction of the core material deposited on the substrate. In one embodiment, a chuck for receiving a disk-shaped substrate wafer is supplied with an embedded electrical heater for maintaining the chuck temperature at from about 700&deg; C. to about 900&deg; C. In another embodiment, a gas heater positioned on a side of the chuck opposite the wafer mounting is provided to heat the chuck at substantially the same temperature. In either embodiment, a chuck is rotated with respect to a line-flame burner which introduces a vaporized mixture of organometallic material into the line-flame burner for depositing a thin film of from about 5 to 6.5 microns of doped glass on the wafer substrate.

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Corning, NY, United States of America

Pascale Laborde