International Business Machines Corporation

Pascale Gagnon

Maryse Cournoyer

Michael A Gaynes

Paul Stephen Andry

Kamal Kumar Sikka

Jon Alfred Casey

Steven Paul Ostrander

Sungjun Chun

Brian W Quinlan

Yang Liu

Charles L Reynolds

Eric Salvas

Martin Beaumier

Alexandre Blander

Christian Bergeron

Jean Labonte

David Edward Turnbull

Jean-Francois Bachand

Denis Blanchard

Luc Tousignant

Eric Giguere

Daniel Mark Dreps

Kirk David Peterson

Marc Adam Bergendahl

Vijayeshwar Das Khanna

Hiroyuki Mori

Jean Audet

Luc Gilbert Guerin

Ravi K Bonam

Dale Curtis McHerron

Isabel De Sousa

Richard D Langlois

Sylvain Pharand

Catherine Dufort

Steve E Whitehead

Stephanie Allard

Charles C Bureau

Dishit Paresh Parekh

Nathalie Meunier

Francois Arguin

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Multicomponent module design and fabrication

A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

Direct bonded heterogeneous integration silicon bridge

An electronic package and a method of manufacture includes a substrate having an upper surface with a trench formed in a bridge region. First pads are arranged on the upper surface of the substrate, outside of the bridge region, and a bridge is positioned in the trench. A plurality of second pads are arranged on an upper surface of the bridge. A plurality of pillars are electrically coupled to the plurality of second pads. Two or more semiconductor chips are positioned in a side-by-side proximal arrangement overlaying the bridge and the substrate. A first semiconductor chip is joined to the bridge, then a second semiconductor chip is joined to the bridge, followed by attaching the chip-bridge assembly to the substrate with the bridge positioned within the substrate trench. Each of the two or more semiconductor chips have first electrical connections including bumps, and second electrical connections including third pads.

Mixed under bump metallurgy (UBM) interconnect bridge structure

A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.

High-density chip-to-chip interconnection with silicon bridge

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Grounded lid for micro-electronic assemblies

Growing community of inventors

Brigham, Canada

Pascale Gagnon