Stmicroelectronics Gmbh

Stmicroelectronics (Grenoble) Sas

Stmicroelectronics S.r.l.

Stmicroelectronics (Grenoble 2) Sas

Pascale Dumont-Girard

Olivier Le Neel

Fuchao Wang

Chengyu Charles Niu

Michel Arnoux

Calvin Leung

Stefania Maria Serena Privitera

MaurizoGabriele Castorina

A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

Vialess integration for dual thin films&#x2014;thin film resistor and heater

A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.

Dual thin film precision resistance trimming

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St. Joseph de Riviere, France

Pascale Dumont-Girard