Osram Opto Semiconductors Gmbh

Pascal Porten

Simeon Katz

Mathias Wendt

The method of producing an electronic component () comprises a step A) of providing a semiconductor chip () having an underside (), having a plurality of contact pins (), and having at least one positioning pin () protruding from the underside. The contact pins are adapted to electrically contact the semiconductor chip. The positioning pin narrows in the direction away from the underside and protrudes further from the underside than the contact pins. The semiconductor chip is placed on the connection carrier, with the contact pins each being inserted into a contact recess and the positioning pin being inserted into the positioning recess. The contact pins are immersed in the molten solder material.

Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip

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Wuppertal, Germany

Pascal Porten