Resonetics, Inc.

Pascal Miller

Chen-Hsiung Cheng

Sergey V Broude

David L Wall

David S Holbrook

Kenneth Todd McDaniel

Rong Gu

Glenn Ogura

James Angell

Jeffrey Bernstein

Kenneth T Mcdaniel

A laser machining system for machining a work-piece includes a laser scanning head, external optical subsystems, and an image acquisition device. The external optical subsystems correspond to optical channels that include a first optical channel and a second optical channel. The laser scanning head controls an optical path so that a laser beam is directed and focused on the work-piece through the first optical channel and the second optical channel at different times. The first optical channel and the second optical channel correspond to respective specific portions of the work-piece to be machined by the laser beam. The image acquisition device is positioned to view the work-piece through the optical path. The image acquisition device acquires via the first optical channel one or more images of the work-piece to determine a displacement of the work-piece with reference to a best optical focus position of the second optical channel.

Laser machining system and method for machining three-dimensional objects from a plurality of directions

Embodiments of the present disclosure are directed to systems (), devices and methods for machining a work-piece from a plurality of directions using a single laser beam and galvanometer scan head (). In some embodiments, such a system includes, for example, a scanning galvanometer head ('scan-head') (), having one or more mirrors () for directing a laser beam in at least one plane. Preferably, in some embodiments, the scan-head includes two mirrors for deflecting the laser beam in the at least one plane (e.g., an X-Y plane). A plurality of second mirrors (A,B,C) is arranged after the scan-head () to direct the laser onto a predetermined portion of the exterior of the object to be machined. In some preferred embodiments, there are three such second mirrors (A,B,C) each to direct the laser over a 120 degree area of the object. In some embodiments, a single, large-field focusing lens is also included to focus the laser output from the scan-head, while in other embodiments, each second mirror includes a corresponding focusing lens (A,B,C). One or more of the beams effecting machining of the work-piece may be unfolded.

Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.

Precision laser ablation

Embodiments of the present invention are directed to methods and systems for micromachining a conical surface. In one embodiment, such a system may include a rotating platform for receiving a long line of laser illumination, a mask having a predetermined pattern comprising a sector of a planar ring, the mask being positioned on the rotating platform, a workpiece stage having a rotational axis for rotating a removably-affixed workpiece comprising a conical surface, wherein the sector comprises the planar image of the conical surface, an excimer laser for producing a laser beam, a homogenizer for homogenizing the laser beam in at least a single direction, at least one condenser lens, a turning mirror and at least one projection lens.

Method and apparatus for laser micromachining a conical surface

Embodiments of the present invention are directed to an illuminating optical device for forming a field of illumination. The optical device includes a first one-dimensional homogenizer positioned to homogenize a first dimension/axis of the field of illumination and a second one-dimensional homogenizer positioned to homogenize a second dimension/axis of the field of illumination.

Methods and apparatuses for homogenizing light

This invention results from the realization that a laser can remove the protective layer(s) from the glass or fused silica optical fiber core and cladding more effectively and more reliably than chemical or mechanical means. This invention teaches methods of using laser beams to remove the protective layers of fibers without significantly damaging the optical and mechanical properties of the fiber and without leaving an excessive amount of residual ablation debris on the fiber while providing careful control of the laser energy. This method thereby allows users to safely strip protective layers off sensitive fibers, such as fibers used for fiber Bragg gratings (FBG). This method allows stripping of the protective layers from single fibers and from multi-fiber ribbon cables. It also allows stripping of the protective layers at an end section of the cable or in a middle section (mid-span).

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Groton, MA, United States of America

Pascal Miller