Intel Corporation

Pardeep K Bhatti

Glen Patrick Gordon

Michael Zack Eckblad

A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member. A retention screw is then extended through the spring collet for connection with the retention mechanism and expansion of the spring collet into locking engagement with the temperature control device to retain the temperature control device.

Fastening system and method of retaining temperature control devices used on semiconductor dies

A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or thermal pyrolytic graphite flakes. The carbon nanotubes and/or thermal pyrolytic graphite flakes are situated between a first surface and a second surface of the heat spreader, to transfer heat from a heat source (e.g., an electronic component) adjacent the first surface to, e.g., a heat sink adjacent the second surface when the heat spreader is incorporated in the assembly. The first surface has a smaller surface area than that of the second surface. Desirably, the carbon nanotubes and/or thermal pyrolytic graphite flakes are aligned extending between the first and second surfaces, and spread out in a direction from the first surface to the second surface, to provide more effective heat transfer and uniform spreading of the heat. The matrix material can be a metal or plastic, and can be compliant, flexible and soft to provide better thermal contact of the heat spreader with the electronic component and heat sink, even if surfaces are uneven, and to provide protection for fragile electronic components against shock and vibration and during structural loading.

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University Place, WA, United States of America

Pardeep K Bhatti