Lsi Corporation

Agere Systems Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Parag Madhani

Ramesh C Tekumalla

Prakash Krishnamoorthy

Donald Earl Hawk, Jr

Paul F Barnes

Kandaswamy Prabakaran

Priyesh Kumar

Coding circuitry comprises at least an encoder configured to encode an instruction address for transmission to a decoder. The encoder is operative to identify the instruction address as belonging to a particular one of a plurality of groups of instruction addresses associated with respective distinct program constructs, and to encode the instruction address based on the identified group. The decoder is operative to identify the encoded instruction address as belonging to the particular one of a plurality of groups of instruction addresses associated with respective distinct program constructs, and to decode the encoded instruction address based on the identified group. The coding circuitry may be implemented as part of an integrated circuit or other processing device that includes associated processor and memory elements. In such an arrangement, the processor may generate the instruction address for delivery over a bus to the memory.

Instruction address encoding and decoding based on program construct groups

An integrated circuit comprises scan test circuitry and additional internal circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises a plurality of scan chains, with each such scan chain comprising a plurality of flip-flops configurable to operate as a serial shift register. The plurality of scan chains are arranged in sets of two or more parallel scan chains. The scan test circuitry further comprises multiplexing circuitry, including a plurality of multiplexers each associated with a corresponding one of the sets of parallel scan chains and configured to multiplex scan test outputs from the parallel scan chains within the corresponding one of the sets of parallel scan chains. In one embodiment, one or more of the sets of parallel scan chains comprise respective pairs of parallel scan chains with each such pair corresponding to a single original scan chain. A given one of the pairs of parallel scan chains comprises an even scan chain and an odd scan chain, formed by reordering the corresponding single original scan chain.

Integrated circuit comprising scan test circuitry with parallel reordered scan chains

Coding circuitry for difference-based data transformation in an illustrative embodiment comprises a difference-based encoder having a plurality of processing stages, with the difference-based encoder being configured to generate respective orders of difference from a sequence of data samples and to output encoded data determined based on at least a selected one of the orders of difference. The coding circuitry may be configured to implement lossless, linear compression of the sequence of data samples. The coding circuitry may additionally or alternatively comprise a difference-based decoder having a plurality of processing stages, with the difference-based decoder being configured to process encoded data comprising selected ones of a plurality of orders of difference and to reconstruct a sequence of data samples based on the selected orders of difference.

Coding circuitry for difference-based data transformation

An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises at least one scan chain having a plurality of scan cells, with the scan chain being configured to operate as a serial shift register in a scan shift mode of operation and to capture functional data from at least a portion of the additional circuitry in a functional mode of operation. At least a given one of the scan cells of the scan chain comprises output control circuitry which is configured to disable a functional data output of the scan cell in the scan shift mode of operation and to disable a scan output of the scan cell in the functional mode of operation.

Low-power and area-efficient scan cell for integrated circuit testing

Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die or substrate with at least two IO buffers. One of the IO buffers is located a distance from a package pin and another of the IO buffers is located another distance from the package pin. One of the IO buffers includes first bond pad electrically coupled to a circuit implementing a first interface type and a floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type. In some cases, the floating bond pad is electrically coupled to the circuit implementing the second interface type via a conductive interconnect, and the floating bond pad is electrically coupled to the package pin.

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die with at least two IO buffers. One of the IO buffers is located a distance from a particular package pin and another of the IO buffers is located a greater distance from the particular package pin. The IO buffer located closest to the package pin includes first bond pad electrically coupled to a circuit implementing a first interface type and a first floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type and a second floating bond pad. In some cases, the first floating bond pad is electrically coupled to the circuit implementing the second interface type via a metal layer wire, and the first floating bond pad is electrically coupled to the particular package pin.

Growing community of inventors

Allentown, PA, United States of America

Parag Madhani