Stmicroelectronics S.r.l.

Paolo Casati

Bruno Murari

Guido Chiaretti

Carlo Cognetti

Amedeo Maierna

An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process

The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.

Optical communication module

The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

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Sesto S. Giovanni, Italy

Paolo Casati