Sgs-thomson Microelectronics S.r.l.

Sgs-microelectronics S.r.l.

Iketon Farmaceutici, S.r.l.

Paolo Casati

Giuseppe Marchisi

Pierangelo Magni

Carlo C De Martiis

Marziano Corno

Mauro Mazzola

Renato Poinelli

Giuseppe Libretti

Renato Conti

Antonio Maggi

Maria B Gorini

A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).

Semiconductor device package with metal-polymer joint of controlled

A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Method for fabricating an electronic device structure with studs

A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means. Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator. According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

Leadframe for supporting integrated semiconductor devices

A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.

Combination and method for coupling a heat sink to a semiconductor device

A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which delimit at least one hollow adapted to receive the plate and to contain resin for forming the device body. Two elements of the mold push the plate from opposed sides against the bottom of the hollow. The hollow has two side extensions which are delimited by the side surfaces of the plate edges, thereby solidified projections are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate has its bottom surface and two side edge portions fully exposed to allow optimum and controllable soldering to a printed circuit board.

Method for manufacturing plastic-encapsulated semiconductor devices with

A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification 'freezes' the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

Apparatus for assembling and resin-encapsulating a heat sink-mounted

A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.

Modular power circuit assembly

An electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has highly reliable means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Electronic device structure with studs locating lead frame on backing

Process and apparatus for assembling and resin-encapsulating a heat

A process for the depolymerization and supersulfation of heparin and the so obtained supersulfated heparins are disclosed. The process comprises treating heparin with oleum containing from 2 to 6% free sulfuric anhydride at a temperature from -10.degree. to +20.degree. C. The obtained heparins have molecular weights from 2000 to 5000 and a sulfation degree from 3.4 to 4.3. All of them are endowed with a remarkable antithrombotic activity.

Growing community of inventors

Milan, Italy

Paolo Casati