Indigo Diabetes N.v.

Imec Vzw

Universiteit Gent

Paolo Cardile

Danaë Delbeke

Juan Sebastian Ordonez Orellana

Ananth Subramanian

Koenraad Van Schuylenbergh

Roeland Baets

Günther Roelkens

Andreas De Groote

A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

Weld protection for hermetic wafer-level sealing

An implantable optical sensor () comprising a substrate () and at least one optical microstructure () for evanescent field sensing integrated with the substrate (), the at least one optical microstructure () being positioned to form an optical interaction area () on a part of a surface () of the substrate (), the optical assembly () further comprising a thin protective layer () covering at least the optical interaction area (), the thin protective layer () being in a predetermined material with corrosion-protection characteristics and having a predetermined thickness, so as not to affect the evanescent field sensing.

Implantable optical sensor

An implantable optical sensor comprises a photonic integrated circuit comprising a substrateand an optical microstructureintegrated with the substrate. The optical microstructure is positioned to form an exposed optical interaction areaon a part of a surfaceof the substrate. A cover capis sealed onto a part of the substrateadjacent to the optical interaction areaand by wafer-to-wafer bonding technology or another wafer-level hermetic packaging technique. At least one active componentis positioned in a sealed cavitywhich is formed between the surfaceand the cover cap. The substratecomprises at least one optical feedthrough, which is an embedded waveguide extending from the sealed cavityto the optical interaction area

Implantable optical sensor with hermetically sealed cover cap

A method for testing an optical assembly () which has an optical microstructure () integrated with a substrate (). The optical microstructure () is positioned to form an external optical interaction area () on a part of a surface () of the substrate (). A cover cap () seals at least a part of the surface () of the substrate () adjacent to the optical microstructure () to obtain a sealed cavity (). An optical feedthrough () is integrated in the substrate () to form an external communication path from within the sealed cavity (). The optical feedthrough () allows communication of a physical parameter value which is measured inside the sealed cavity () to outside the sealed cavity (). The physical parameter value is associated with a measure of hermeticity of the sealed cavity ().

Hermeticity testing of an optical assembly

An on-chip broadband radiation source, and methods for its manufacture such that a photonics IC comprises an optical waveguide such as a semiconductor waveguide, a thin III-V material membrane with absorption capability for absorbing an optical pump signal induced in the waveguide. The III-V membrane comprises a LED implemented therein. The photonics IC also comprises a coupling means between the waveguide and the membrane. The device provides a broadband radiation source at a wavelength longer than the wavelength of the transferred radiation. The broadband signal can then be coupled out through the waveguide and used in the chip.

Growing community of inventors

Ghent, Belgium

Paolo Cardile