Delphi Technologies, Inc.

Gm Global Technolgoy Operations, Inc.

Pankaj Mithal

Steven E Schulz

Mark Wendell Gose

Peter James Savagian

John Mark Dikeman

Daniel J Berry

Paul F Turnbull

Chia-Chou Yeh

Stephen P Barlow

William David Higdon

Frank Stepniak

Bradley R Knigga

Patrick A Davis

Paul C Staab

Steven A Middleton

A vehicle includes a power source, a motor, and a computing device. The power source provides electrical energy to the motor, and the motor generates rotational motion from the electrical energy received. The computing device is configured to estimate a temperature of the motor in real time based at least in part on a thermal model of the motor. The thermal model includes a plurality of nodes and at least one thermal resistance. Each node represents a region of the motor and each thermal resistance represents a heat transfer path between at least two of the nodes. A method includes solving one or more energy balance equations to determine a temperature change at each node and estimating the temperature of the motor in real time based at least in part on the temperature change at each node and at least one of the thermal resistances in the thermal model.

Motor temperature estimation based on thermal model

A portable digital scale is foldable for ease of storage and transport. The scale includes a fluid-filled elastomeric bladder and electronic module disposed in a hard-sided case that is opened in use and folded to encase the bladder and electronic module during transport and storage. The electronic module includes a pressure sensor for detecting the fluid pressure in the bladder as a measure of the user's weight, and a user interface and digital display for displaying the weight and/or other parameters requested by the user. Preferably, the electronic module includes a memory device capable of storing multiple weight measurements and a data port for down-loading stored weight data to a personal computer or PDA for tracking weight variation of one or more users over time.

Folding digital scale

A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

Flip-chip interconnected with increased current-carrying capability

An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

Electronic module

An IC power package particularly suitable for use as a rectifier for an automotive ac generator, as well as an IC packaging method. The power package comprises an electrically-conductive base, a MOSFET die mounted to the base so that the drain region of the MOSFET is electrically connected to the base, an electrically-conductive pin mounted to the die and electrically connected to the source region of the MOSFET, and an electrically-conductive member electrically connected to the gate region of the MOSFET. The conductive member can take several forms, including a second pin or a leadframe mounted to the die, or an annular-shaped member mounted to the base by an electrically-insulative member. In the latter embodiment, the annular-shaped member may be electrically connected to the gate region with a bond wire. The die is preferably encapsulated on the base, so that the base, pin and conductive member provide three connections for a rugged IC package.

Press-fit IC power package and method therefor

Growing community of inventors

Kokomo, IN, United States of America

Pankaj Mithal