Systems on Silicon Manufacturing Company Pte. Ltd.

Pankaj Kumar Uttwani

Shankaran Chelliah

Yee Ming Chan

Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device.

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Singapore, Singapore

Pankaj Kumar Uttwani