Meta Platforms, Inc.

Facebook, Inc.

Pankaj Kansal

Abdulkadir Utku Diril

Olivia Wu

Krishnakumar Narayanan Nair

Aravind Kalaiah

Anup Ramesh Kadkol

Arvind Srinivasan

Harikrishna Madadi Reddy

Naader Hasani

Linda T Cheng

A system includes a first integrated circuit package including a first group of one or more artificial intelligence processing units and a first chip-to-chip interconnect communication unit and a second integrated circuit package including a second group of one or more artificial intelligence processing units and a second chip-to-chip interconnect communication unit. The system also includes an interconnect between the first integrated circuit package and the second integrated circuit package, wherein the first chip-to-chip interconnect communication unit and the second chip-to-chip interconnect communication unit manage ethernet-based communication via the interconnect using a layered communication architecture supporting a credit-based data flow control and a retransmission data flow control.

Chip-to-chip interconnect with a layered communication architecture

A system including an array of processing elements, a plurality of periphery crossbars and a plurality of storage components is described. The array of processing elements is interconnected in a grid via a network on an integrated circuit. The periphery crossbars are connected to a plurality of edges of the array of processing elements. The storage components are connected to the periphery crossbars.

Optimizing NOC performance using crossbars

A system comprises a processor coupled to a plurality of memory units. Each of the plurality of memory units includes a request processing unit and a plurality of memory banks. The processor includes a plurality of processing elements and a communication network communicatively connecting the plurality of processing elements to the plurality of memory units. At least a first processing element of the plurality of processing elements includes a control logic unit and a matrix compute engine. The control logic unit is configured to access data from the plurality of memory units using a dynamically programmable distribution scheme.

High bandwidth memory system with dynamically programmable distribution scheme

A system comprises a processor and a plurality of memory units. The processor is coupled to each of the plurality of memory units by a plurality of network connections. The processor includes a plurality of processing elements arranged in a two-dimensional array and a corresponding two-dimensional communication network communicatively connecting each of the plurality of processing elements to other processing elements on same axes of the two-dimensional array. Each processing element that is located along a diagonal of the two-dimensional array is configured as a request broadcasting master for a respective group of processing elements located along a same axis of the two-dimensional array.

High bandwidth memory system with distributed request broadcasting masters

A system comprises a processor coupled to a plurality of memory units. Each of the plurality of memory units includes a request processing unit and a plurality of memory banks. Each request processing unit includes a plurality of decomposition units and a crossbar switch, the crossbar switch communicatively connecting each of the plurality of decomposition units to each of the plurality of memory banks. The processor includes a plurality of processing elements and a communication network communicatively connecting the plurality of processing elements to the plurality of memory units. At least a first processing element of the plurality of processing elements includes a control logic unit and a matrix compute engine. The control logic unit is configured to access the plurality of memory units using a dynamically programmable distribution scheme.

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Fremont, CA, United States of America

Pankaj Kansal