Samsung Electronics Co., Ltd.

Pan Suk Kwak

Dae Seok Byeon

Myung Hun Lee

Doo Sub Lee

Jung Hwan Choi

Young Don Choi

Jin Do Byun

Min Jae Lee

Dong Ha Shin

Kyung Min Ko

Young-hoon Son

A nonvolatile memory device includes a peripheral logic structure including a peripheral circuit on a substrate, a horizontal semiconductor layer extending along an upper surface of the peripheral logic structure, stacked structures arranged in a first direction on the horizontal semiconductor layer and including interlayer insulating films and conductive films alternately stacked in a direction perpendicular to the substrate, a first opening disposed between the stacked structures and included in the horizontal semiconductor layer to expose a part of the peripheral logic structure and a second opening arranged in a second direction, which differs from the first direction, from the first opening, included in the horizontal semiconductor layer, and disposed adjacent to the first opening. The peripheral logic structure includes a control transistor overlapping the second opening in a plan view and controlling operation of the plurality of stacked structures.

Nonvolatile memory device with openings in the substrate and nonvolatile memory system including the same

A non-volatile memory chip comprises a cell region that includes a first surface, a second surface opposite to the first surface, a first cell structure, and a second cell structure spaced apart from the first cell structure; a peripheral circuit region on the first surface of the cell region, and that includes a first peripheral circuit connected to the first cell structure, a second peripheral circuit connected to the second cell structure, and a connection circuit between the first and second peripheral circuits; a through via between the first and second cell structures and that extends from the second surface of the cell region to the connection circuit of the peripheral circuit region; a redistribution layer that covers the through via on the second surface of the cell region, is connected to the through via, and extends along the second surface; and a chip pad connected to the redistribution layer.

Nonvolatile memory chip and semiconductor package including the same

A mold structure includes gate electrodes stacked on a first substrate, a channel structure penetrating a first region of the mold structure to cross the gate electrodes, a first through structure penetrating a second region of the mold structure, and a second through structure penetrating a third region of the mold structure. The mold structure includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell and dummy blocks includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.

Semiconductor memory device with mold structure

A memory device includes; a memory cell array including a memory cell connected to a bit line, a page buffer unit receiving data from the memory cell via the bit line, and a contact unit providing an electrical path through which the data is communicated from the memory cell array to the page buffer unit, wherein the contact unit comprises a sub-bit line configured to connect the bit line via a first contact with the page buffer unit via a second contact.

Memory device having sub-bit lines and memory system

An integrated circuit memory device includes a memory cell array including first and second bit lines that extend side-by-side, a plurality of page buffers, a first isolation device electrically coupled to an end of the first bit line, and a second isolation device electrically coupled to an end of the second bit line. The second isolation device is arranged farther from the plurality of page buffers than the first isolation device. A first connection line is electrically coupled at a first end thereof to the first isolation device, and is electrically coupled at a second end thereof to one of the plurality of page buffers. A second connection line is electrically coupled at a first end thereof to the second isolation device, and is electrically coupled at a second end thereof to a farther one of the plurality of page buffers. The second connection line is arranged immediately adjacent to the first bit line.

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Seoul, South Korea

Pan Suk Kwak